[Engineering Feature]
The Mixed-Signal Angle On DFM
David Maliniak
ED Online ID #21219
June 11, 2009
Copyright © 2006 Penton Media, Inc., All rights reserved. Printing of this document is for personal use only.
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When most designers think of DFM, they
think of deep-submicron SoCs and digital
design. But more often, DFM is a factor in
analog/mixed-signal flows for RFICs as well.
“There’s no such thing as a pure RFIC anymore,”
says Marc Peterson, director of RFIC
product planning at Agilent EEsof. “All RFICs
are mixed-signal chips these days, and they’re
moving to the smaller process nodes where
process variability is a much bigger problem.”
A key part of mixed-signal design is transistor
models, which weren’t always so useful
in terms of manufacturability effects such as
stress. These parameters have never been part
of Berkeley short-channel IGFET (insulatedgate
field-effect transistor) models (BSIMs).
Over the past few years, though, transistor
models have improved substantially. The Penn
State-Philips (PSP) advanced compact model
for MOSFETs, released in its first standard version
by the Compact Model Council in 2006,
accounts for non-quasistatic effects such as
electron distribution in the MOSFET channel.
PSP models also allow stress-based analysis at
the transistor level.
Agilent EESof’s Integrated Circuit Characterization
and Analysis Program (IC-CAP) was
one of the first transistor modeling tools that
implemented the PSP extraction algorithms,
enabling foundries to create MOSFET models
that included these non-quasistatic effects.
“That was important because foundry enablement
is critical if you want adoption of a
modeling standard,” says Paul Colestock, RFIC
marketing lead at Agilent EEsof. “If you can’t
capture effects in the model, all the analyses in
the world won’t make your silicon correlate.”
Another critical analysis category for mixedsignal
design is simulation. “Corner analysis
is now done for everything,” says Colestock.
“But does that analysis capture everything
you want it to? Corner models may or may not
include RF effects. Are the models really covering
corners for things like maximum oscillating
frequency, noise, or intermodulation products?
They’re usually not that RF-centric.”
One solution is to run a large number of statistical
simulations, but that quickly becomes
a bottleneck in the design process. There are
ways to achieve decent statistical results without
running all of those simulations, though.
Agilent EESof’s Golden Gate simulator enables
Monte Carlo statistical analysis in a number of
ways, including correlation analysis from block
to block or over levels of hierarchy. It also
offers a full Monte Carlo sampling approach at
circuit level.
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