Simon Pack received a 1st Class MEng in electrical and electronic engineering from Nottingham University. He has worked in high-speed embedded microelectronic design for the last 15 years. Email address: simon.pack@motorola.com
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June 9, 2005[POV: Point Of View] Challenges Grow, But It's All In A Day's Work
The relentless pace of change in electronics design means an increasing number of challenges for product designers, along with shorter development cycles and tighter budgets. One involves a general trend in the electronics industry away from parallel bus-based interconnections, such as PCI and EIDE, toward high-speed serial interconnects, like Ethernet as a backplane fabric, PCI Express, SATA, RapidIO, InfiniBand, and Star Fabric. These fabrics offer better fault resilience and high...
Simon Pack received a 1st Class MEng in electrical and electronic engineering from Nottingham University. He has worked in high-speed embedded microelectronic design for the last 15 years.
