Author - Barry Dagan

Technologies
- Analog
- Communications
- Components
- Digital ICs
- EDA
- Embedded
- Power
- Test
Design Hotspots
- Analog
- Embedded
- Power
- Green Design
Resources
Shows
- ESC 2009
- Embedded World 2009
- APEC
- CES
- electronica
- NI Week
- MTT-S
- DAC
- MD&M
- PCIM
Magazine
eBooks & Whitepapers
Jobs
More...
- eBooks
- Whitepapers
- Webcasts
- Job Zone
- Newsletters
- Blogs
- Hall of Fame
- RSS
- Subscribe

Click to view this week's ad screen

Barry Dagan	Write for Electronic Design
Barry Dagan is chief technology officer of Cool Innovations Inc. He holds multiple patents and has designed a number of breakthrough thermal-management products. Email address: barryd@coolinnovations.com Web site: http://www.coolinnovations.com
1 results found for Barry Dagan, displaying items 1 - 1

March 27, 2008 [EEPN In Electronic Design]
For More Efficient Cooling, Try Splayed Pin-Fin Heatsinks
The immense processing power generated by today’s cutting-edge ICs enables engineers to design extremely powerful applications. Unfortunately, the higher processing power comes with a dramatic increase in the magnitude of heat dissipation that makes heatsink selection a very complex task. Splayed pin-fin heatsinks consist of a base and an array of embedded round pins splayed outwards (Fig. 1). Forged...