David Sideck
Write for Electronic Design
David Sideck has been with FCI for 30 years and has held various connector product management and marketing positions during his career. He is currently global market manager for the High Speed & Power Products Business Line.
Email address: david.sideck@fci.com
1 results found for David Sideck, displaying items 1 - 1

 

September 25, 2008   [EEPN In Electronic Design]
Achieve Higher Backplane Density
Equipment designers, particularly those involved with communications and high-end data, face the constant challenges of increasing data rates and greater packaging densities. In turn, these requirements are driving development needs for compact, high-speed components, including connectors. DESIGN CHALLENGES High-speed computing and networking system designers have the benefit of choosing from cost-effective, high-speed ...










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