Author - Richard Crisp

Technologies
- Analog
- Communications
- Components
- Digital ICs
- EDA
- Embedded
- Power
- Test
Design Hotspots
- Analog
- Embedded
- Power
- Green Design
Resources
Shows
- ESC 2009
- Embedded World 2009
- APEC
- CES
- electronica
- NI Week
- MTT-S
- DAC
- MD&M
- PCIM
Magazine
eBooks & Whitepapers
Jobs
More...
- eBooks
- Whitepapers
- Webcasts
- Job Zone
- Newsletters
- Blogs
- Hall of Fame
- RSS
- Subscribe

Click to view this week's ad screen

Richard Crisp	Write for Electronic Design
Richard Crisp is the director of semiconductor technology and applications for Tessera. He joined Tessera in July 2003 and is currently responsible for semiconductor package development, applications engineering, semiconductor technology and infrastructure development. He spent 10 years associated with the International Solid State Circuits Conference (ISSCC) as the Conference Chair (2000), Vice Chair (1999) and Memory Subcommittee Chair (1998, 1997) and was a member of the Memory Subcomittee (1991-1996). He holds over 17 issued U.S. patents with another nine pending. He graduated cum laude in electrical engineering from Texas A&M University in 1976. Email address: rcrisp@tessera.com Web site: http://www.tessera.com
1 results found for Richard Crisp, displaying items 1 - 1

July 23, 2009 [Electronic Design Products]
High-Density IC Packaging Looks At The Third Dimension
Much has been written in the past few months about the upcoming sunset of Moore’s Law. Stated succinctly, Gordon Moore predicted in 1965 that the number of transistors in ICs would double every 12 months1. There have been other versions of his prediction, including shifts to a performance metric and altered timeframes. However, the message is clear: a key metric doubles on a regular schedule and has for many years. Moore has also stated that no...

PartFinder

GlobalSpec

PART SEARCH :
	Powered by: