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Roger Engelke

Roger Engelke is the Issue Editor of Electronic Design.


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Author Articles

  • New Implant Strategy Offers Hope To Brain-Disorder Sufferers

    By Roger Engelke, April 21, 2009

    A prototype multi-electrode stimulation and recording probe for deep-brain stimulation, unveiled by IMEC at this week’s Design, Automation & Test in Europe (DATE) conference, opens up possibilities for more effective stimulation with less side effects...

  • Ultra-Thin Chip Breathes More Flexibility Into Wearable Electronics

    By Roger Engelke, March 11, 2009

    Leuven, Belgium: A new 3D integration process will help foster a new level of flexibility in wearable electronics such as health and comfort monitoring. An ultra-thin chip package (UTCP) technology developed by IMEC and Ghent Univ. makes it possible to in

  • New Electric Hybrid Bicycle Unveiled

    By Roger Engelke, December 02, 2008

    Tokyo, Japan: An electric hybrid bicycle is the latest entry in Sanyo’s eneloop universe (see the figure). The eneloop bike is designed to be, and claimed as, the industry’s first to conform to the newest standards, offering up a “Power-up Mode” assist ra

  • Improve Your Knowledge And Know-How At The CES Sessions

    By Roger Engelke, December 01, 2008

    The axiom “knowledge is power” certainly applies to the 2009 International CES. Boasting the consumer technology industry’s largest educational forum, this year’s program delivers more than 200 conference sessions with over 500 expert speakers, coverin

  • Breakthrough In Skin-Like Optical Sensing Foils

    By Roger Engelke, October 07, 2008

    Leuven, Belgium: Building on last year’s rigid-surface development, INTEC reports that it’s produced the first functional optical links embedded in a flexible substrate. INTEC is IMEC’s associated laboratory at Ghent University. With this technique, it be

  • Collaboration Formed For Green LED Manufacturing

    By Roger Engelke, October 03, 2008

    Leuven, Belgium and Osaka, Japan: Growing demand for brighter green LEDs is the driving force behind a joint agreement inked by IMEC and Taiyo Nippon Sanso. The main goal of their pact is to develop manufacturing technology for high-efficiency light-emitt

  • ISDB-T Reception Enhances FlexiTV For TV On A PC

    By Roger Engelke, October 02, 2008

    Fleet, U.K.: An enhanced version of the FlexiTV broadcast receiver, developed by Mirics Semiconductor Inc., debuted this week at CEATEC Japan. The receiver uses the same silicon hardware that demonstrated what the company claims was the first software-dem

  • LG Opts For Ericsson Mobile Broadband Modules

    By Roger Engelke, October 02, 2008

    Stockholm, Sweden and Seoul, Korea: LG Electronics selected Ericsson to provide mobile broadband modules based on high-speed packet access (HSPA). The modules will be used in LG’s next-generation notebooks and netbooks slated for release this year.

  • Chevrolet Unveils Production-Version Volt

    By Roger Engelke, September 17, 2008

    The much-talked-about Chevrolet Volt electric vehicle has moved from concept car to production model. As part of General Motors’ centennial celebration, Chevrolet lifted the curtain on the production version Volt, which delivers 40 miles of gasoline- and

  • Joint Research Effort Focuses On RF Transistors For Cognitive Radios

    By Roger Engelke, April 24, 2008

    Renesas Technology Corp. and IMEC (an independent nanoelectronics research center) will collaboratively perform research on 45nm RF transceivers that target gigabit-per-second cognitive radios. Upon this agreement, Renesas effectively joins IMEC’s softwar

  • New Year's Eve Ball Celebrates Its Centennial By Going Green

    By Roger Engelke, December 13, 2007

    As the stroke of midnight approaches on December 31, the throng of revelers in New York Cityâ??s Times Square and billions of TV viewers worldwide will count down and gaze at a descending, brilliantly lit ball to mark the new yearâ??no surp

  • Battelle's Top 10 Strategic Technologies For 2020

    By Roger Engelke, June 30, 2005

    With our industry still trying to recoup from the dot-com detonation amidst the rush to offshore outsourcing, the China/India impact, and the U.S. engineering graduate falloff, one can't help but wonder what the future holds. Such prognosticat

  • Fast Forward

    By Roger Engelke, June 30, 2005

    See associated...