LEDs Light The Way To Lower-Cost Illumination

By Roger Allan, April 12, 2012

LED lighting continues to achieve greater efficacies. Still, greater attention is being paid to manufacturing and packaging developments to make it more cost-competitive with incandescent and compact fluorescent bulbs.

Semiconductor ICs Spearhead A Medical Imaging Revolution

By Roger Allan, March 12, 2012

The need to lower costs and bring medical imaging scanning closer to the patient is being solved with improvements in semiconductor ICs and software. Technology enabled medical scanning equipment is making such systems lower in cost, higher in performance, and smaller in size.

Chipworks Analysis: Linear Technology’s LTC3108 DC-DC Converter For Energy Harvesting Apps

By Roger Allan, March 05, 2012

This is an in-depth analysis of Linear Technology's LTC3108 dc-dc converter for energy harvesting applications. The device can start up and operate from input voltages as low as 20 mV.

MEMS Accelerometer Sets Size And Cost Benchmarks

By Roger Allan, January 24, 2012

The MEMSIC MXC626Xc accelerometer is based on a thermal technique that enables higher reliability in the industry’s smallest package for the lowest cost, according to the company.

Is 3D IC Packaging Ready For Prime Time?

By Roger Allan, December 28, 2011

The market need for low-cost, smaller-size, and denser IC packages is accelerating. Silicon interposers in TSVs are the key. Modeling tools, more sophisticated processes, improved materials, and the quest for greater standardization are onging with more needed to be done.

A Host Of 3D IC Collaborations And Standardization Efforts Emerging

By Roger Allan, December 28, 2011

Semiconductor IC companies, foundries, packaging houses, software developers and standards organizations are trying hard to advance 3D IC technology using through-silicon vias (TSVs).

System-Level Applications Make MEMS Ubiquitous

By Roger Allan, December 27, 2011

MEMS device technology is proliferating across multiple application areas. Key driving forces include wireless technology and Internet access.

Warm Up To The Latest PCB Cooling Techniques

By Roger Allan, October 04, 2011

Software simulation and a careful thermal analysis layout is needed for present and future high-performance and high-density ICs.

Industrial Machine-Vision Systems Get An Image Makeover

By Roger Allan, September 09, 2011

A behind-the-scenes look at how semiconductor technology is making the inspection and monitoring of factory-made products more productive and more accurate.

ADC Establishes Medical Imaging Firsts For Size, Performance

By Roger Allan, June 16, 2011

The Texas Instruments ADS5263 is the smallest high-speed, high-resolution analog-to-digital converter (ADC) for high-end imaging applications.

Microelectronics: The Medical Industry’s Mini Marvels

By Roger Allan, June 09, 2011

Diagnostic and therapeutic medical procedures are undergoing a revolution in better healthcare thanks to advances in electronics technology

Precision “Down-Hole” MEMS Accelerometer Takes The Heat

By Roger Allan, May 20, 2011

The ADXL206 dual-axis iMEMS accelerometer sensor from Analog Device suits for geological down-hole exploration. Improvements include its ability to operate in high temperatures, its small size, and its rugged construction.

HP And Shell Prepare Advanced Geophysical Seismic Sensing

By Roger Allan, April 11, 2011

Greater use of ICs in consumer electronics products is pushing the demand for higher-density, lower-cost and higher-performance ICs, giving a greater push to package devices in 3D form.

Expect GaN To Play A Role in Future LEDs and Power Devices

By Roger Allan, April 07, 2011

With Better Energy Efficiency, LED Lighting Moves Closer To The Mass Market

By Roger Allan, April 07, 2011

An examination of where LEDs fit for lighting and illumination

Tiny MEMS Microphone Improves Portable Voice Quality

By Roger Allan, March 29, 2011

Akustica is introducing its fourth-generation fully integrated AKU230 CMOS digital microphone on a 0.7-mm2 single-chip die, the world’s smallest. This tiny die includes an acoustic transducer, a pre-amplifier, and a sigma-delta modulator.

Better Medical IC Technology Gets Ready To Make House Calls

By Roger Allan, March 10, 2011

Semiconductor IC technology is forming the bedrock of portable and affordable medical equipment, much of it for personal use at home, at a local clinic, or even while traveling. Driving forces include an aging population, longer life spans, and the need to control rising healthcare costs. Major electronics companies are eager to cash in on these beckoning market opportunities.

Thanks To TSVs, 3D IC Packaging Gets Set To Tackle Tough Challenges

By Roger Allan, March 03, 2011

As IC dimensions get smaller and smaller, the need for increasing packaging densities becomes greater. And the logical way to do this is via 3D packaging. A key approach is to use through-silicon vias (TSVs). But this technology is not quite ready, although it is making some key advances. Needed are valid business models guidelines on how different manufacturing, design, and packaging houses should interact with each other in this effort.

MEMS Silicon Expansion Valve Heads Toward New HVAC Applications

By Roger Allan, December 10, 2010

Ultrasound Imaging System Design Just Got Easier

By Roger Allan, December 09, 2010