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Author Articles

  • Smart Cut Process Technique—An Overview

    By André Auberton-Hervé, May 12, 2003

    Smart Cut is Soitec's proprietary technology, used to manufacture the company's UNIBOND SOI wafers. Based on two key techniques—ion implantation and wafer bonding—the process begins with two bulk silicon wafers, one of which is reused to...

  • Silicon-On-Insulator Technology Bumps Up SoC Performance

    By André Auberton-Hervé, May 12, 2003

    Full article begins on Page 2 As the semiconductor industry shifts to 0.13-µm and smaller devices, IC designers must strongly consider materials issues. The substrate material upon which chips are built can profoundly...