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Jack Browne

Editorial Director, Wireless Systems Design


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  • Ceramics For High-Power Packages

    Ceramics For High-Power Packages

    By Jack Browne, July 26, 2011

    Newer power RF semiconductor technologies are enabling higher power levels in smaller device sizes, making packaging materials a real concern. Beryllium oxide (BeO), aluminum nitride (AlN), and alumina (Al2O3) are good thermal conductors, and BeO has long been the ceramic of choice for microelectronics packages through about 4 GHz.

  • Military Systems Bolstered By Building-Block Breakthroughs

    By Jack Browne, December 01, 2008

    Technological advances lead to tactical advantages. That’s why investments in electronic technology for military applications traditionally run high. Yet those investments can often yield useful breakthroughs as well as dramatic improvem

  • Fast Data Converters Advance Wireless Systems

    By Jack Browne, March 01, 2005

    Data converters can be thought of as the central cores of wireless-infrastructure systems. Complex signals must be digitized upon reception and converted to analog form for transmission. To meet the needs of present and future-generation wireless-infras

  • RF RMS Power Detector Measures Two Signals Simultaneously

    By Jack Browne, March 01, 2005

    To support the data converters in wireless-infrastructure equipment, Analog Devices has introduced a dual-channel RF root-mean-square (RMS) power detector. This power detector measures transmit and receiver signal levels to 2.7 GHz. Known as the AD836

  • Amplifiers Drive Broad Applications

    By Jack Browne, December 01, 2004

    General-purpose amplifiers (GPAs) can be thought of as the "RF glue" in wireless systems. Although they're simple in design, these amplifiers must boost RF signals to acceptable levels. They also must overcome the losses that are accrued by a...