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Dave Treleaven

David Treleaven holds a BASc in engineering physics from the University of British Columbia, an MSc in electronic engineering from the University of Saskatchewan, and a PhD in electronic engineering from the University of Calgary. He has over 29 years experience in analog and digital circuit design, particularly in the telecommunications field. He has been with Chipworks for more than 10 years, specializing in analog and mixed-signal technology. His involvement includes analysis of integrated circuits, semiconductor component parts, and communications devices and systems. Prior to joining Chipworks, he worked at TRW Semiconductors and Westinghouse.


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  • 1.5-Bit Stages In Pipeline ADCs

    By Dave Treleaven, May 11, 2006

    Use of pipeline analog-to-digital converters (ADCs) continues to expand, both as standalone parts and as embedded functional blocks in system-on-a-chip (SoC) ICs. They boast acceptable resolution at high-speed operation and can be integrated onto relative

  • Paying For Double Density

    By Mike Christie, April 13, 2006

    The tried-and-true axiom of "you don't get something for nothing" certainly can apply to the latest multilevel NAND flash chips. Though they dramatically increase the memory capacity in a given core die area, it's at the expense of more compl

  • The Reverse Engineer's View

    By Dave Treleaven, January 12, 2006

    There's hype, and then there's reality. When it comes to leading-edge chips, the chasm between the two is rather wide. Reverse engineers tear these technologies apart for a perspective that often diverges far from commentaries offered by the chipmakers an