Embedded in Electronic Design

1127 results found for Embedded in Electronic Design, displaying items 1 - 20

 



June 25, 2009
COM Module Adds Atom
Kontron’s microETXexpress-DC Computer-on-Module features a 1.6-GHz N270 Intel Atom processor with the 945GSE and ICH7M chipsets. The 3D graphics accelerator handles dual independent displays with support for SVDO, LVDS, VGA, and TV-out.  — William Wong

June 25, 2009
Atom Comes In A Tiny ECX Package
The Atom-based ML936-B16 fits into the 105- by 146-mm Embedded Compact Extended (ECX) form factor sponsored by Intel. This is a nice match with 3.5-in. form factors. The single-board computer includes a low-power, 1.6-GHz Z530P Intel Atom processor and a US15WP System Controller Hub (SCH).  — William Wong

June 25, 2009
3U CompactPCI Family Suits Rugged Apps
The F50x family of rugged CompactPCI single-board computers and conduction-cooled racks is designed for for –40°C to 85°C environments.  — William Wong

June 25, 2009
Smallest MCU Hits 2- By 2-mm Form Factor
Silicon Laboratories continues to push down the size of 8-bit microcontrollers. Its C8051T606 mixed-signal microcontroller comes in a 2- by 2-mm, 10-pin mini small-outline package (MSOP). It is also available in 3- by 3-mm, 14-pin small-outline IC (SOIC) and 10-pin quad flat no-lead (QFN) packages.  — William Wong

June 25, 2009
AdvancedTCA Board Supports Eight Cores
Diversified Technology’s ATC6239 Dual Quad-Core board is powered by 2.4-GHz AMD “Shanghia” Opteron processors with 6 Mbytes of L3 cache. The PICMG 3.1-compatible board supports up to 32 Gbytes of DRAM plus dual-port 10-Gbit Ethernet.  — William Wong

June 11, 2009
Are You Using More Than One Software Analysis Tool?
Actually, a better question for many embedded developers is whether they’re using even one code analysis tool. In many cases, the number of static or dynamic analysis tools used by a programmer is zero. At the same time, the goal that seems to be on top of everyone’s list is getting bug-free software done on time. Unfortunately, this can be a challenge when you aren’t using these tools. Most developers know that finding and fixing bugs early is less...  — William Wong

June 11, 2009
The Latest Static And Dynamic Analysis Tools
Designers can take advantage of a host of new static and dynamic code analysis tools from different vendors. Coverity has a range of static and dynamic analysis tools, but its Coverity Build Analysis addresses an aspect that is key to the development process but often overlooked—the build process. It helps Coverity stand out from the pack in addition to helping prevent bugs in the build process by identifying issues such as using the wrong object...  — William Wong

June 11, 2009
Flash Storage Device Delivers 300k Ops/s Using DDR2 RAM
Untitled Document Looking for some really fast nonvolatile storage? DDRdrive delivers doubledata- rate (DDR) performance with NAND nonvolatility. Its DDRdrive X1 adds an FPGA between a PCI Express Gen 1...  — William Wong

June 11, 2009
Chip Links PCI Express And USB
The OXPCIe200 PCI Express (PCIe) bridge links a 1x PCI Express host to a pair of USB host interfaces or one USB host interface and an SPI/SRAM interface (see the figure). The bridge also provides access to a serial port and eight generalpurpose I/Os (GPIOs). The bridge’s dual-USB mode provides one high-speed and one full-speed USB 2.0 host interface. The high-speed interface has a...  — William Wong

June 11, 2009
Common-Law Accelerator Offloads DSP
Adding a Control Law Accelerator (CLA) to Texas Instruments’ line of C28x DSPs can boost performance in applications such as motor control, LED lighting, and digital power by a factor of five. This allows the TMS- 320F2803x chip to handle more demanding applications or deliver high performance with lower power requirements. The F2803x family’s C28x DSP core delivers 60 MIPS. Compared to the F2802x, the newer siblings provide peripheral ...  — William Wong

June 11, 2009
NAND Delivers Capacity And NOR Capabilities
Samsung’s Flex One NAND has moved to 40 nm. It combines multi-level cell (MLC) and single-level cell (SLC) flash with an SRAM front end providing NOR functionality, including the ability to run applications directly. The Flex One uses a 2-kbyte SRAM cache to implement SLC flash. Designers can configure the flash memory split into SLC (code and data) and MLC (data) partitions. MLC storage density is twice the 1-bit/cell total for the SLC...  — William Wong

May 15, 2009
Multifunction Flash Runs Remote Apps On Smart Phones
Citrix and Open Kernel Labs have joined forces to deliver remote application execution to smart phones and other devices running Open Kernel Labs OKL4. The secure, partitioned hypervisor allows organizations to deliver enterprise applications via Citrix Receiver, a remote-control application, connected to a Citrix Server.  — William Wong

May 15, 2009
Tiny Linux Suits Renesas Chips
RoweBots Research has delivered a pair of ultra-tiny, Linux-compatible real-time operating systems (RTOSs) for Renesas’ R8C, M16C, and R32C/100 microcontroller families. The DSPnano and Unison are also POSIX-compatible. Both work with Renesas’ High-performance Embedded Workshop (HEW) integrated development environment (IDE).  — William Wong

May 15, 2009
MCU Sleeps Using 20 nA
The nanoWatt XLP line of 8- and 16-bit microcontrollers from Microchip reduces power draw to 20 nA when sleeping in its lowest-power mode. The eXtreme Low Power (XLP) technology supports a range of sleep modes including a 400-nA watchdog and 500-nA real-time clock mode. These chips are designed for use in sealed battery and energy-harvesting applications.  — William Wong

May 7, 2009
A Zoom Lens Improves Photos As Well As Vision Systems
The lens and the capture electronics are the two most critical pieces of a vision system. Skimp on either, and the results are sub-par. Going with a fixed glass lens often improves quality over a plastic lens, but an adjustable zoom lens provides more options without having to move the camera. This is handy in taking photographs, but it can be useful in a range of other imaging applications as well, including robotics. Adding a built-in zoom lens to...  — William Wong

May 7, 2009
Module Makes High Speed USB Easy
Need a High Speed USB serial link? Then check out DLP Designâ??s module based on the latest chip from Future Technology Devices International (FTDI). The DLP-USB1232H has a standard 18-pin dual-inline package (DIP) form factor. The FTDI FT2232H is designed to handle the 480-Mbit/s High Speed USB specification, allowing the system to handle transfers up to 12 Mbaud, essentially being limited by the RS-232 transfer rate. The chip can handle bulk...  — William Wong

May 7, 2009
Stackable Options
The 2009 Embedded Systems Conference was the host for a range of stackable options using new standards such as SUMIT and StackableUSB. The 420-by-372 USB3201 LCD from Micro/Sys is designed to work with StackableUSB boards. It has 4 Mbits of serial flash on board plus an optional touch screen. Versalogicâ??s Ocelot single-board computer with a 1.6-GHz Atom processor sports SUMIT-104 connectors. The PC/104 ISA connector provides legacy support...  — William Wong

May 7, 2009
Small Form Factor SBC Stacks
VIA Technologiesâ?? Pico-ITXe single-board computer (SBc) builds on the 10- by 7.2-cm Pico-ItX form factor and adds the Small Form Factor SIGâ??s SUMIT stackable connectors (Fig. 1). the motherboard holds up to 2 Gbytes of DDR2 and has Gbit Ethernet and dual SATA ports. The SUMIT expansion supports PCI Express, USB, I2C, and LPC. The VIA P710-HD board can plug into the SBC to add...  — William Wong

May 7, 2009
PCI Express Switches Large And Small
PLX Technology offers a range of 5-Gbit/s PcI Express Gen 2 switch chips for almost every embedded application. the high-port-count, multi-root/host chips include the 24-port, 96-lane PEX 8696. also, the 48-, 60-, and 80-lane versions can handle up to eight root/hosts and support multicast and read pacing. the 35- by 35-mm package uses 11 W. Pricing starts at $78.40 for the 48-port PEX 8649. the four-port, 16-lane PEX 8613 and three-port, 12-lane...  — William Wong

May 7, 2009
Multicore Chip Handles Broadband Packet Processing
The Octeon II from Cavium Networks handles packet traffic on high-speed serial links such as 10-Gbit Ethernet, Serial RapidIO (SRIO), and PCI Express (PCIe) v2. The chip family is scalable from two to six MIPS cores augmented with a collection of accelerators from the Security Vault secure key storage to RAID 5/6 support for storage applications (see the figure). The CN63xx can ...  — William Wong





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