789 results found for Technology In The News, displaying items 1 - 20
November 10, 2009
Micronail Chip Links Electronics With Bio Cells
IMEC (www.imec.com), a nanotechnology research center based in Leuven, Belgium, has developed a unique microchip with microscopic nail structures that enables close communication between electronics and biological cells.
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Staff
November 4, 2009
FXI And Atmel Create First microSD Gaming-Console For Mobile Phones
Atmel Corp. unveils what it calls the first cross-platform mobile phone gaming consoles implemented in microSD cards, based on a system-on-chip (SoC) developed by FXI Technologies AS using Atmel’s 90-nm SiliconCity flexible architecture.
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ED News Staff
October 6, 2009
Low-Cost Silicon Solar Cell Raises Efficiency Bar
Teaming up, IMEC’s research centers for photovoltaics and energy company BP Solar demonstrate an 18% conversion efficiency for silicon solar cells made of BP Solar’s recently-developed Mono2 silicon.
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ED News Staff
October 5, 2009
Lab-On-Chip Delivers Rapid Cancer Detection And Therapy
IMEC nanotechnology research center, the Institüt für Mikrotechnik Mainz (IMM), a research center in microfluidics, and their mutual partners within the European Sixth Framework Project MASCOT unveil what they are calling a lab-on-chip for the detection and therapy evaluation of breast cancer.
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ED News Staff
October 5, 2009
Design Service Offers Innovative Radio Chips
IMEC nano-electronics research center and its analog/mixed-signal design spinoff, ANSEM, now collaborate to offer customized radio ICs for wireless communication applications.
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ED News Staff
September 30, 2009
NIST Approves G.hn For In-Home Use On The Smart Grid
G.hn, a technology for existing-wire home networking that is intended to complement Wi-Fi, has been approved for use in Smart Grid applications by the National Institute of Standards and Technologies (NIST).
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Don Tuite
September 30, 2009
Major Players Team Up To Create Mobile Wired Connectivity Standard
Pooling talents and resources to form a Mobile High-Definition Interface Working Group, Samsung Electronics Co., Ltd., Silicon Image, Inc., Sony Corp., Nokia Corp., and Toshiba Corp. plan to create an industry standard for an audio/video interface to connect mobile phones or portable consumer electronics devices directly to high-definition televisions and displays.
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ED News Staff
September 15, 2009
ZigBee RF4CE Specification Now Downloadable
First announced in March 2009, the ZigBee RF4CE specification for advanced remote controls is now available for download. The spec replaces infrared with RF communication in remote controls. Thus, consumer-electronic (CE) remote controls for HDTV, home-theater equipment, set-top boxes, etc., will have greater range and longer battery life, as well as be able to operate out of line-of-sight.
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ED News Staff
September 15, 2009
A New Kind Of Space Walk—The COLBERT Treadmill
NASA opted for the Combined Operational Load Bearing External Resistance Treadmill (COLBERT) for use in the International Space Station. Quantum Controls Inc., working with Woodway USA (the treadmill supplier), Wyle Laboratories, and NASA, successfully met all expectations of motor control for the treadmill, and the required certifications for space travel.
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ED News Staff
September 2, 2009
Wireless Sensor System Improves Sleep Monitoring
IMEC’s lightweight, wearable system consists of a headband with three sensor nodes that measure two electroencephalogram (EEG) channels to monitor brain activity, two electrooculogram (EOG) channels to monitor eye activity, and an electromyogram (EMG) channel to monitor chin muscle activity. These five signals provide the required information for sleep staging according to the Rechtschaffen and Kales standard (the R&K standard classifies EEG-sleep recordings).
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ED News Staff
September 1, 2009
Chinese Stimulus Policy Opens New Business Streams For Semiconductor Vendors
By increasing efforts to work with local Chinese manufacturers, semiconductor vendors could reap the rewards of growing domestic demand for home appliances, according to tech research firm Gartner Inc. Driving the demand is a Chinese government subsidy program, translated as Electronics Go to Farmers (EGF).
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ED News Staff
June 17, 2009
Germanium Gate-Stack Technology Provides High Carrier Mobility
Toshiba Corp. announced this week that it has made advancements in its development of a gate stack and interlayer with high carrier mobility that can be applied to metal-insulator-semiconductor field-effect transistors (MISFETs) in future generations of LSIs. The ultra-thin, high-k/Ge gate stack and strontium germanide (SrGex) interlayer can provide the high carrier mobility needed for application in MISFETs at the 16-nm node and beyond.
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ED News Staff
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