June 17, 2009
Germanium Gate-Stack Technology Provides High Carrier Mobility
Toshiba Corp. announced this week that it has made advancements in its development of a gate stack and interlayer with high carrier mobility that can be applied to metal-insulator-semiconductor field-effect transistors (MISFETs) in future generations of LSIs. The ultra-thin, high-k/Ge gate stack and strontium germanide (SrGex) interlayer can provide the high carrier mobility needed for application in MISFETs at the 16-nm node and beyond.
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ED News Staff
June 10, 2009
Simple, Low-Cost Materials Create Flexible Memory
Researchers at the National Institute of Standards and Technology (NIST) are developing memory chips with the ability to bend and twist. The July 2009 issue of IEEE Electron Device Letters reports that the engineers have found a way to build a flexible memory component out of inexpensive, readily available materials.
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ED News Staff
June 10, 2009
Advanced Circuits Buys Top PCB Firm
In a bold move to enrich its printed-circuit-board (PCB) portfolio, Advanced Circuits Inc. acquired the assets of Circuit Board Express. The Haverhill, Mass.-based Circuit Board Express is recognized as a leader in quick-to-market manufacturing of PCBs.
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ED News Staff
June 3, 2009
University Research Yields Flexible CMOS Circuits
Researchers at Arizona State University's Flexible Display Center (FDC) and the University of Texas at Dallas (UT Dallas) have successfully produced CMOS circuitry on a flexible plastic substrate.
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ED News Staff
June 3, 2009
OLED Displays Surpass Million-Hour Lifetime
A solution-based third generation (Gen 3) organic light emitting diode (OLED) technology from DuPont Displays has yielded substantial performance gains for printable OLED materials.
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ED News Staff
May 27, 2009
Serial Port Memory Technology Pushed For Next-Generation Interface Specification
An industry consortium formed by Hynix Semiconductor, LG Electronics, Samsung Electronics, and Silicon Image is promoting Serial Port Memory Technology (SPMT) for adoption as a new industry standard. SPMT would be the first-of-its-kind specification for dynamic random access memory (DRAM).
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ED News Staff
May 12, 2009
Green Forum Explores Use Of DC Power In Buildings
A workshop titled “EPRI/LBNL DC Power Partners Workshop,” was added to the First Annual Green Building Power Forum (GBPF ’09) being held June 1-3 in Anaheim, Calif. This particular workshop will identify the current status and future plans for the development of dc power distribution including: business case considerations, safety factors, quantification of the energy savings and reliability benefits, and standardization issues.
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ED News Staff
May 1, 2009
2009 nanoPower Forum Unveils Advances In Low-Power Technology
Low-power system design, practical energy harvesting, thin-film batteries, and power management for wireless systems will be spotlighted at the third annual nanoPower Forum (nPF ’09) taking place May 18-20 in San Jose, California.
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ED News Staff
April 29, 2009
ISA Approves The First Standard For Industrial Wireless Applications
The ISA100 Standards Committee on Wireless Systems for Automation has voted to approve a new industry standard, ISA100.11a. “Wireless Systems for Industrial Automation: Process Control and Related Applications” was approved by 81% of the voting members of the committee including 23 of the 24 end user members.
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ED News Staff
April 21, 2009
PICMG Consortium Releases New COM Express Design Guide
Congatec AG, a leading supplier of embedded computer modules, has announced the immediate availability of Version 1.0 of the COM Express Design Guide for developers of COM Express modules...
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ED News Staff
April 21, 2009
New Implant Strategy Offers Hope To Brain-Disorder Sufferers
A prototype multi-electrode stimulation and recording probe for deep-brain stimulation, unveiled by IMEC at this week’s Design, Automation & Test in Europe (DATE) conference, opens up possibilities for more effective stimulation with less side effects...
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Roger Engelke
April 14, 2009
MIT Researchers Uncover Path To Narrower Semis
Researchers at MIT have found what they are calling a novel method for etching extremely narrow lines on a microchip using a material that can be switched from transparent to opaque, and vice versa by exposing it to certain light wavelengths.
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ED News Staff
April 14, 2009
Web-Based Weather Stations Monitor More Than Temperature
Sitting on top of the green rooftop of Ford Motor Company’s truck plant in Dearborn, MI are two Onset HOBO U30 weather stations that monitor soil moisture levels on the rooftop as well as general weather conditions.
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ED News Staff
April 2, 2009
Standby Device Promises 10% Global Energy Reduction
The brainchild of the Live EDGE 2008 Electronic Design for the Global Environment Challenge winner Pedro Rodrigues from Portugal is a system that automatically detects the standby mode of electrical equipment and disconnects the power when it is not required.
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ED News Staff
March 24, 2009
Winners Of Live EDGE To Be Announced
Service distributor Premier Farnell plc and its companies Farnell, Newark, Premier Electronics, Farnell-Newark CPC, and MCM will announce the winners for the Live Electronic Design for the Global Environment (EDGE) during a special virtual communications technology conference on April 2.
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ED News Staff
March 23, 2009
IEEE Approves Low-Power IC Standard
Under the number IEEE 1801, the IEEE has approved the Standard for Design and Verification of Low Power Integrated Circuits. Also known as Unified Power Format 2.0 (UPF 2.0), the standard was developed by Accellera and currently carries the support of multiple vendors and is in use worldwide.
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ED News Staff
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