| COMPONENTS ADDRESSED BY RoHS | ||
| Key component (Technology Working Group) | Environmental needs | Time frame |
| Packaging | Pb-free lead finishes and BGA balls Pb-free C4 High-temperature reliability, especially ceramic BGA Br-free mold compound |
2004-5 2005-8 2004-5 2006-8 | Interconnect substrates: organic | Pb-free finish Lower cost/enhance reliability of Br-free laminates |
2004-5 2005-8 |
| Interconnect substrates: ceramic | Pb and other impurities | 2004-8 |
| Displays | Alternative to Hg in lamps Improved energy efficiency |
2004-8 Ongoing |
| Mass data storage | RoHS exemption for commercial data storage Pb-free magnetic and optical drives for consumer electronics |
2008 2004-5 |
| Optoelectronics | High-temperature (235°C to 265°C) compatibility | 2004-5 |
| Source: iNEMI |
The International Electronics Manufacturing Initiative (iNEMI) has developed a roadmap of environmental issues. It suggests that for component manufacturers to remain competitive, it's critical that global electronic firms improve their existing processors and develop, qualify, and introduce new materials, components, and processes during the 2005-2008 timeframe. Differences between product sectors shown here are primarily driven by exemptions in RoHS legislation.