763 results found, displaying items 121 - 140

The newly introduced BlueAnt V1 Bluetooth headset uses Sensory Inc.’s BlueGenie Voice Interface to provide integrated voice control and high-quality speech synthesis technology. The V1 is the first Bluetooth headset with a true voice user interface (VUI) and the first stand-alone headset with Bluetooth version 2.1, according to the company.

Graphics processing units (GPUs) from NVIDIA are delivering over 1 petaflop (1000 teraflops) of processing power in a distributed computing application at Stanford University. According to statistics published by the university, 11,370 active NVIDIA GPUs provided 1.251 petaflops, or 42% of the total processing power for the Folding@home application.

Mitsubishi Digital Electronics America (MDEA) has chosen the MAP-M audio processor and FRC-M 120-Hz frame-rate converter for the MDEA 149 series of premium flat-panel TVs. MDEA’s 149 series TVs are the first televisions worldwide to use Micronas’s Digital Sound Projector, which is based on the company’s widely deployed MAP-M audio processor.

The Technology Editor Bill Wong runs the VIA Technologies’ Pico-ITX-based ARTiGO through its paces along with Fujitsu’s 320-Gbyte SATA drive.

Kensington has selected WiQuest Communications Inc. as the sole wireless USB solution provider for the new Wireless USB Docking Station—the first wireless USB docking station certified by the USB-IF. The system uses WiQuest’s Wireless USB Device Mini Card reference design.

Problems involving dropped calls and the inability to receive faster 3G service on Apple’s new iPhone 3G may be related to a communications chip made by Infineon Technologies. Sources quoted by BusinessWeek said that faulty software on the chip causes problems when the iPhone needs to switch from wireless networks that allow faster downloads to slower ones.

The number of SoCs that require an interface to off-chip memory is increasing. As a result, more and more designers are turning to DDR SDRAM interfaces such as DDR, DDR2, and DDR3 to address their low-cost, security of supply, storage capacity, and performance requirements. Fortunately for those designers, DRAMs have been standardized since the 1970s. But this still leaves a challenge that most SoC engineers don’t recognize until things start to go wrong.

Citing the breadth of Microchip Technology Inc.’s analog and digital products, Bel Power Inc. has selected two Microchip devices for use in a next-generation Power over Ethernet (PoE) half-brick dc-dc converter.

Semiconductor makers STMicroelectronics and Infineon have teamed with 3D packaging provider STATS ChipPAC to jointly develop the next generation of embedded Wafer-Level Ball Grid Array (eWLB) technology. The technology will be based on Infineon’s existing eWLB packaging, which has been licensed to both STMicroelectronics and STATS ChipPAC.

Recently, I encountered a real gotcha while updating a visual design tool. The update included support for a new compiler vendor who was, in fact, becoming the new default compiler. So I updated the tool, loaded a project that worked five minutes earlier, rebuilt the project with no errors and no warnings, and then programmed the part. I applied power, and nothing happened! Not one line of code had changed, and no errors or warnings were generated. What was the problem?

Panasonic has incorporated Altera Corp.’s Cyclone III FPGAs into its P2 professional-grade HD camcorders. The FPGAs provide HD video processing, an interface to P2 memory cards, and LCD display control. The devices deliver the highest ratios of memory-to-logic and DSP-to-logic of any low-cost FPGA family, according to Altera.

The China Earthquake Administration has selected a structural health monitoring (SHM) system from CGM Engineering Inc. to help engineers conduct research on seven recently constructed megastructures. CGM, a National Instruments Alliance Partner, based the system on the NI LabVIEW graphical system design platform and NI CompactRIO programmable automation controllers.

The first USB device certified by the WiMAX Forum, the MiMAX Q-Series USB dongle from Airspan Networks Inc., incorporates the SkyCross Isolated Mode Antenna Technology (iMAT). Introduced by SkyCross in late January, iMAT allowed the MiMAX to be certified for the 2.5-GHz band, operating at nearly every applicable WiMAX and Wi-Fi frequency from 2 GHz to 5 GHz.

Mitel has chosen Octasic Inc.’s media processing technology to provide echo cancellation for the Mitel 5000 Network Communications Solution and the Axxess Converged Communication System. The Axxess product line uses open architecture interfaces and standard protocols to transparently combine IP, wireless, digital, and analog into a single platform to unify communications into one interoperable enterprise.

Texas Instruments has revealed a low-power processor roadmap for 2009 that includes more than 15 new multi-architecture devices across four product lines. A breakthrough, the company says, will be the industry’s lowest power floating-point DSPs, the TMS320C674x family. For the first time, designers will be able to bring portability to applications requiring the high-precision and fast time-to-market provided by floating-point processors.

Today, most companies target the needs of their prospective customers by creating a product line rather than a single product. Yet due to multiple intertwined products with different features and production deadlines, developing software for a product line is extremely complex. These challenges can hinder your company’s ability to capture the window of opportunity, maximize quality, and expand the scope of your product-line portfolio, making it difficult to obtain a competitive edge.

iSuppli – After a teardown of the iPhone 3G, iSuppli Corp. confirmed a significant drop in bill of material (BOM) costs, indicating a cheaper end product than last year’s 2G iPhone. At $174.33, the BOM and manufacturing cost of the new iPhone is markedly less than the $227 that iSuppli estimated for the first-generation, 8 Gbyte 2G version in June 2007. This strip down results in about $100 less for consumers, totaling $499 for the iPhone 3G, whereas last year’s model called for $599.

Technology Editor Bill Wong talks with MontaVista about Mobilinux 5.0, which includes support for SELinux security features.

How does Apple improve on cutting-edge technology? Check out the 3G iPhone's bill of materials (BOM), released by iSuppli.

The BlueStack and Interface Express software packages from Cambridge Consultants have enabled PlanOn Systems Solutions Inc. to design a “pocket-size” printer with Bluetooth connectivity. The Printstik, which measures just 48 by 25 by 280 mm (1.89 by 0.9 by 11.02 in.), incorporates the BlueStack software on a single BlueCore chip from Cambridge Silicon Radio. The ruggedized printer weighs 680 g (1.5 lb.).

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