763 results found, displaying items 141 - 160

Hauppauge Computer Works’ PCI Express TV tuner will employ three ICs from NXP Semiconductors. The WinTV-HVR-2250 will incorporate the NXP SAA7164E PC TV system-on-a-chip (SoC) as well as two TDA18271HD silicon tuners.

The National Telecommunications and Information Administration (NTIA) has certified Apex Digital Inc.’s DT250 ATSC analog pass-through converter box to participate in the government’s coupon program. The box incorporates the SupraHD 741 processor design from Zoran Corp. The Coupon-Eligible Converter Box program supports the conversion of U.S. television broadcasts from analog to digital technology.

A new waterproof cell phone scheduled for high-volume production in the fourth quarter of 2008 will employ AuthenTec’s TouchStone fingerprint sensor packaging technology, according to Authentec. The TouchStone package allows easy integration into various waterproof industrial design configurations. It offers the durability and water resistance required for this new class of handsets while adding Power of Touch features, including security, convenience, personalization, and navigation.

Scopus Video Networks will use Horizon Semiconductor's high definition decoding technology in its receiver processor for multi-channel ATSC decoding/down conversion. Horizon designs semiconductor devices used for secure video/audio compression and transmission in the consumer electronics and broadcast markets.

It’s getting harder for U.S.-based industries to maintain competitiveness in business segments that have been moving offshore. But a collaboration between two universities and a maker of electronic interconnects has resulted in a pioneering microelectronics manufacturing research and development center.

In Jack Ganssle’s anthology, Embedded Systems: World Class Design, he has collected over a dozen articles that span the embedded system design spectrum. Ganssle’s compilation touches on motors, testing, system level design, sensors, actuators and controls, version control systems, state machines, firmware/hardware musings, close loop control, video encoding, analog I/O, optimizing DSP software, and embedded processors.

Hitachi Ltd. has selected Analog Devices Inc.’s Advantiv advanced television ICs to drive wireless functionality, flexibility, and seamless high-definition connectivity in Hitachi’s TP-WL700H consumer wireless transmission hub. The hub employs three Advantiv ICs to provide enhanced HD video compression, decompression, and transmission technology.

Using a 34-nm process technology developed by their joint venture—IM Flash Technologies—Intel Corp. and Micron Technology Inc. have introduced a 32-Gbit multi-level cell memory chip measuring only 172 mm². The chip uses the smallest NAND process geometry on the market and is the only monolithic device at this density that fits into a standard 48-lead thin small-outline package (TSOP), according to the companies.

Working with the U.S. Naval Research Laboratory (NRL), Bioident Technologies Inc. is developing a portable multi-parameter detector in the form of a lab-on-a-chip system, to permit cost-effective point-of-use applications. The work is being done under a Defense Advanced Research Projects Agency (DARPA) contract as part of the “Printed Diagnostic Arrays” project.

Mindspeed Technologies Inc. has licensed the CEVA-X1641 DSP core and CEVA-XS1200A Subsystem from CEVA Inc. to power a new generation of high-performance IP-based next-generation network (NGN) media and data solutions.

Electronic Design's Editor-in-Chief Joe Desposito went a long way to catch the IEF. Catch up with him on his journey to Dubai, where IEF was held this year, and his impressions of the forum.

Three major players in the semiconductor industry have agreed on the need for industry-wide collaboration to target a transition from 300-mm wafers to 450-mm wafers by 2012. Intel Corp., Samsung Electronics, and TSMC said they will cooperate with the industry to help ensure that all of the required components, infrastructure, and capability are developed and tested for a pilot line by the target date.

DuPont and Dainippon Screen Manufacturing Co. Ltd. have agreed to form a strategic alliance to develop integrated manufacturing equipment for printed organic light emitting diode (OLED) displays. The companies also intend to bring together the elements needed—materials, technology and equipment—to mass produce OLED displays.

Freescale Semiconductor has completed its acquisition of SimaTel Inc., paying $3 per outstanding share of SigmaTel stock, a total of about $110 million in cash. The privately held Freescale will merge SigmaTel’s technology and employees with Freescale’s Multimedia Applications Division, which reports to Lynelle McKay, senior vice president and general manager of the company’s Networking and Multimedia Group.

With worldwide demand for LCD televisions increasing, Samsung Electronics Ltd. and Sony Corp. have agreed to establish a second, eighth-generation amorphous TFT-LCD manufacturing line (“8-2 line”) through their joint venture, S-LCD Corp. The 8-2 line will be built at the Tangjeong Complex, with production slated to start in the second quarter of 2009.

NEC has chosen Freescale Semiconductor’s highly integrated, low-power MCF5328 ColdFire processor to provide remote-access capabilities for its Lui line of Valuestar R desktop PCs for home media servers. The processor balances performance and power efficiency, enabling a PC remote server board to operate within a 1-W envelope.

Technology editor Bill Wong takes a look at Intel’s new Centrino Atom processor designed for low power, mobile Internet devices (MID) as well as other embedded applications.

Media Excel is using the Texas Instruments’ DaVinci technology digital media processor in a new generation of professional video compression appliances. The HERA 4000 line of transcoder products can rapidly encode, transcode, and distribute professional, broadcast-quality video to any device over any network at a much higher speed and lower cost than previous solutions, according to Media Excel.

After effectively superseding the PCI bus, PCI Express interconnect technology is now entrenched in its early high-growth markets: PCs, workstations, servers, and storage systems. It has started to penetrate other markets as well, and it is on track to become more popular than any previous interconnect standard. This success has come about for two reasons.

Siemens’ Industry Automation Division has incorporated the Freescale Semiconductor 4-Mbit MRAM device into Siemens’ Simatic Multipanel MP 277 and MP 377 human-machine interface (HMI). Siemens performed extensive qualification testing before choosing Freescale’s magnetoresistive RAM for the HMI targeting industrial automation systems.

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