[Ideas For Design] Design An Adaptable Power Supply For XENPAK
XENPAK is a multisource agreement (MSA) for a 10-Gbit transceiver package. As part of the XENPAK MSA, each XENPAK module requires input power from an adaptable power supply (APS) that resides on a backplane. ...
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Brian King
[Ideas For Design] Protect MOSFET Driver From Reverse-Battery Connection
It's vital that MOSFET power-switch drivers be protected from a reverse-battery connection. A small rectifier diode can shield against reversed batteries. But that approach is generally unacceptable for systems whose battery life is crucial. For a 6-V...
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Mark Cherry
[Editorial] Cyberterrorism Must Never Gain A Foothold Anywhere
In these uncertain times, we must look both outside and inside our borders for potential sources of terrorism. However, even greater vigilance is needed regarding our computer and communication networks. These networks have no borders that we can...
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Dave Bursky
[POV: Point Of View] A Move To Advanced Packaging For Glue Logic
Advanced packaging technology for logic functions has been ahead of demand for the past five years or so. For much of this period, customers seeking smaller packages for their logic gates have been limited to leaded package styles. These packages...
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Ken Murphy
[Pease Porridge] Bob's Mailbox
Dear Bob: When scanning the index (electronic design, Jan. 6, p. 20), I saw "K2-W" and put on the brakes. Hey, I bet that's Philbrick's stuff. Yes, it is! I looked in my junk box because a couple of K2s were once in there. No,...
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Bob Pease
[TechView: The Industry] UMTS-Based Chip Set Gives 3G Big Boost
Adoption of 3G cell phones hasn't set any speed records, especially in the U.S. But 3G is on its way. Notably, Texas Instruments (TI) has invested substantially in the Universal Mobile Telecommunications System (UMTS) 3G standard that uses wideband...
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Louis E. Frenzel
[TechView: The Industry] EDA Rides The PCI Express
Acceptance of a new standard is a chicken-and-egg affair. Which comes first, acceptance or the wherewithal to accept it? In the case of the emerging PCI Express high-speed interconnect standard for next-generation system design, the EDA and...
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David Maliniak
[TechView: Analog & Power] Breaking News
Cree now samples silicon-carbide (SiC) Schottky diodes with 1200-V breakdown voltages. The high-voltage rating on these devices makes them suitable as anti-parallel diodes for high-frequency inverters, snubber diodes for high-current IGBT inverters,...
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David G. Morrison
[TechView: Analog & Power] Hot Products
COST-CUTTING INSTRUMENT AMP DELIVERS HIGH ACCURACY The LTC6800 3-V instrumentation amplifier guarantees an offset voltage below 100 µV with an offset drift of just 0.25 µV/°C. This value of offset drift...
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David G. Morrison
[TechView: Embedded] Chip Stacks JVM, SRAM, Flash
Java processor chip includes a memory interface that shares stacked SRAM and flash memory chips with a host CPU. Java-enabled cell phones with a small footprint require packages like Nanoamp's SmartCombo multichip carrier (MCP) solution,...
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William Wong
[TechView: Embedded] Hot Products
TOOL SUITE SMOOTHES LINUX, VPN GATEWAY INTEGRATION Building an embedded Linux server or VPN gateway is a snap using the NetMax Professional Suite and VPN Server 4.01 from Cybernet Systems. The servers are managed via...
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William Wong
[TechView: Embedded] Fast Simulation Makes Analysis Practical
AN ARRAY OF NEW, HIGH-PERFORMANCE simulation tools for Texas Instruments' Code Composer Studio (CCS) DSP development suite makes it practical to test applications for the TMS320C5000 and TMS320C6000 without having hardware in hand. Program simulations...
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William Wong
[TechView: EDA] Unified Verification Flow Takes Higher Ground
Cadence's new verification platform provides native support for high-level languages and transaction-level virtual prototypes. Verification of systems-on-a-chip (SoCs) is hard and getting harder. Not only are today's verification flows...
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David Maliniak
[TechView: EDA] Hot Product
Achieving signal integrity becomes increasingly difficult as silicon processes shrink. Analysis tools can find many signal-integrity problems, but it is accurate models that can help turn the tide. Silicon Metrics' SiliconSmart SI tool provides the...
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David Maliniak
[TechView: EDA] RET Tool Paces Processes
IC manufacturers are struggling mightily with subwavelength feature sizes as silicon processes descend further into the nanometer realm. To combat the problem, Mentor Graphics tweaked its Calibre suite of resolution enhancement technology (RET) tools...
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David Maliniak