-
By David Hall, May 25, 2012
National Instruments' David Hall shows you how to augment microwave spectrum analysis with PC-based test equipment, model extraction, and hardware-in-the-loop (HIL) simulations to improve your wireless design process.
-
By Daniel Herzog, May 24, 2012
First found decades ago in chicken brooders, these components still are effective in applications ranging from soda machines to submarines.
-
By Daniel Gallant, May 24, 2012
Getting the best performance from the PCI Express interface requires careful selection of the clocking method.
-
By David Maliniak, May 25, 2012
Building a modular test strategy can provide great flexibility in capabilities, or the system can be tailor-made for specific requirements. Often a hybrid approach encompassing traditional box instruments is best. Here are some basics to consider in ...
-
By Ian Bower, May 23, 2012
TI's Ian Bower looks at the differences between implenting analog and mixed-signal functionality hardware and firmware with the goalof helping designers in one domain comfortable when working with designers in the other.
-
By Lou Frenzel, May 24, 2012
Soitec's new fully depleted wafers use silicon on insulator technology to implement smaller feature devices down to 20 nm.
-
By William Wong, May 22, 2012
AMD's R-Series accelerated processing units (APU) is built around a quad core x86 platform with a GPU that has 384 cores.
-
By Chao-Yu Chen, May 22, 2012
Some legacy designs use a non-split transaction type bus protocol DDR3 memory channel. This design unifies the channel design so SoC designers do not have to create separate memory channels to prevent the non-split transaction.
-
By Lou Frenzel, May 18, 2012
Introduction to some of the new power line communications chips ready to implement PLC in OFDM.
-
By Lou Frenzel, May 18, 2012
As concerns about interference, noise, and attenuation are addressed, new standards expand PLC’s role in the home and industry.
-
By Jay Mckenna, May 23, 2012
Micro fasteners enable lower part counts and assembly time resulting in smaller, lighter, thinner, and cheaper consumer electronics.
-
By Tom Curatolo, May 17, 2012
Vicor's Tom Curatolo describes how to stack dc-dc regulator modules in data centers and other installations that distribute 400-V dc power.
-
By Andy Gryc, May 21, 2012
HTML5 is poised to take over the Internet. Here are the basics about this technology.
-
By Martin Keim, May 18, 2012
This article details the differences between the older JTAG (IEEE-1149.1) standard and the newer Internal JTAG (IJTAG, IEEE-P1687) standard for test of printed-circuit boards and ICs.
-
By William Wong, May 16, 2012
Silicon Labs has a program to sell raw die of their 8- and 32-bit micrcontrollers for use in custom designs.
-
By Mat Dirjish, May 16, 2012
Abundant and efficient, crystalline-silicon solar cells have been around since the 1950s, but thin-film solar cells are the new kids set to become the medium of choice.
-
By Steve Sandler, May 18, 2012
You can't directly measure the stability of many regulators, but you can evaluate stability through measurement or simulation of the device's output impedance.
-
By William Wong, May 16, 2012
MIPS Technologies has a new name for its product family, Aptiv. The family is divided into three performance solutions including proAptiv, interAptiv and microAptiv.
-
By William Wong, May 21, 2012
Ridley Scott utilizes the latest digital animation and 3D techniques to deliver a blockbuster sci-fi film.
-
By Paul Whytock, May 15, 2012
Selected from a total of 230 contributions, it focuses on next-generation silicon-carbide (SiC) planar MOSFETs, trench structure Schottky diodes, and trench MOSFETs.