Embedded Hardware
3834 results found for Embedded Hardware, displaying items 1 - 20

 

September 4, 2008   [Technology In The News]
AdvancedAMC Board Features 64-Core Processor
The new T6M-100 AdvancedMC (PrAMC) platform from JumpGen Systems incorporates the Tilera TILE64 processor, with 64 cores of general-purpose compute capability running at 700 MHz. The single-wide T6M-100 is one of several JumpGen PrAMC products that support 10-Gbit/s Ethernet interfaces addressing growing market requirements for IP networks.  — ED News Staff

September 2, 2008   [Web Exclusive]
Engineering A Hall Of Famer
Once a year we at Electronic Design ask our readers to stand up and recognize those who have made major contributions to the electronic engineering world. Our “2008 Electronic Design Hall of Fame” is primed to hoist another class of engineer superheroes onto your proverbial shoulders.  — John Arkontaky

August 29, 2008   [Technology In The News]
ASSET Helps Establish Boundary-Scan Initiative
ASSET InterTech recently became one of the founding members of the International Electronics Manufacturing Initiative’s (iNEMI) boundary-scan adoption project. The initiative—a consortium of over 70 manufacturers, suppliers, and related organizations—started the project to encourage greater use of the IEEE 1149.1 boundary-scan standard (commonly known as JTAG, after the Joint Test Action Group, which defined the original specification).  — ED News Staff

August 27, 2008   [Designed In]
NXP Device Integrates DVR, Time-Shifting Into TVs
European television manufacturer Loewe has chosen the SAA7164 system-on-a-chip (SoC) from NXP Semiconductors to provide digital video recorder (DVR) and time-shifting functions in Loewe’s new hybrid LCD TVs. The SAA7164 forms the core SoC of a highly integrated encoder module that enables consumers to pause or record analog sources in addition to digital programs onto a hard disk drive, without the need for an external set-top box.  — ED News Staff

August 27, 2008   [Technology In The News]
NVIDIA GPUs Powering Stanford Medical Research
Graphics processing units (GPUs) from NVIDIA are delivering over 1 petaflop (1000 teraflops) of processing power in a distributed computing application at Stanford University. According to statistics published by the university, 11,370 active NVIDIA GPUs provided 1.251 petaflops, or 42% of the total processing power for the Folding@home application.  — ED News Staff

August 28, 2008   [Engineering Feature]
Portable Craze Redefines The Dashboard
TText, blog, or twitter hands-free while driving. Access your car’s iPod media player to change tracks and adjust the volume without lifting a finger. Even host a three-way telephone call via a Bluetooth device without your hands leaving the steering wheel. No longer content with standard features for low-end and mid-range cars, drivers expect satellite navigation, multizone climate control, satellite radio, and even beverage refrigeration as standard items. ...  — Roger Allan

August 26, 2008   [Lab Bench Online]
VIA ARTiGO: Small But Powerful
The Technology Editor Bill Wong runs the VIA Technologies’ Pico-ITX-based ARTiGO through its paces along with Fujitsu’s 320-Gbyte SATA drive.  — William Wong

August 26, 2008   [Technology In The News]
Mitsubishi Premium TVs Use Micronas Technology
Mitsubishi Digital Electronics America (MDEA) has chosen the MAP-M audio processor and FRC-M 120-Hz frame-rate converter for the MDEA 149 series of premium flat-panel TVs. MDEA’s 149 series TVs are the first televisions worldwide to use Micronas’s Digital Sound Projector, which is based on the company’s widely deployed MAP-M audio processor.  — ED News Staff

August 28, 2008   [Editorial]
For Consumer Electronics, The Holidays Start In July
As an editor with a major electronics magazine, I’m invited to industry events all the time. Come July, though, I start receiving invitations from public relations folks for events that are really outside the magazine’s coverage—events that show the hottest consumer electronics items for the coming holiday season. I can’t resist the temptation. Could you? SAMSUNG HOLIDAY IN JULY Samsung Electronics recently held its...  — Joseph Desposito

August 28, 2008   [Technology Report]
Dev Kits Help Alleviate Those FPGA Design Woes
Design at the logic level for board-level products is rare. If it can’t be done with a microcontroller or two, then what’s a designer to do? FPGAs have been the answer for years, but FPGA tools required a steep learning curve. Likewise, FPGAs had a price premium and high power requirements, and external support requirements often proved challenging. All of that has changed, though. Inexpensive FPGAs are now the norm. High-performance products remain...  — William Wong

August 28, 2008   [Design View / Design Solution]
Eye-Diagram Analysis Speeds DDR SDRAM Validation
Double-data-rate synchronous dynamic random access memory (DDR SDRAM) physical-layer testing is a crucial step in making sure devices comply with the JEDEC specification. The ultimate goal is to guarantee interoperability when different memory devices are used together and that they work when powered up. Fundamentally, interoperability begins at the physical layer. For a DDR memory interface, the responsibility of good physical-layer performance falls at...  — Min Jie Chong

August 28, 2008   [Engineering Essentials]
Modern DSP Chips Serve Up Variations On A Theme
Digital signal processors (DSPs) earn their living by doing certain analog jobs better than analog circuitry. In some cases, where analog circuits can’t even be considered for a task due to cost or complexity reasons, DSPs are still a viable choice and in many cases perform those tasks effortlessly. That’s because DSPs are very good and very fast at arithmetic operations such as addition and multiplication. Clever mathematicians and engineers exploit this...  — Joseph Desposito

August 28, 2008   [Leapfrog: First Look]
45-nm Via-Programmable ASICs Add High-Speed I/O Transceivers To Feature Mix
ASIC design starts have plummeted in recent years, and there are many good reasons why. Designs at ultra-deep-submicron process nodes are awfully expensive and getting more so daily as mask costs rise, software content proliferates, and verification takes longer. Meanwhile, the steady rise of application-specific standard products (ASSPs) has also contributed heavily to the ASIC’s marketshare slide. Thus, many designers have turned to alternative...  — David Maliniak

August 28, 2008   [TechView: Digital]
Cold, Dense, And Gratis MCU Core Targets FPGAs
Did you know that at 5515 kg/m3, Earth is the densest planet in our solar system? Most of that density is made up in the Earth’s core, which became so dense during the early stages of the Earth’s 4.5 billion-year life in a process called planetary differentiation. During this process, and while the Earth was still a ball of molten elements, denser substances such as iron sank toward the center, and the dense core as we know it today was formed. Not to be...  — Daniel Harris

August 15, 2008   [Technology In The News]
Report Cites Chip Programming For iPhone 3G Problems
Problems involving dropped calls and the inability to receive faster 3G service on Apple’s new iPhone 3G may be related to a communications chip made by Infineon Technologies. Sources quoted by BusinessWeek said that faulty software on the chip causes problems when the iPhone needs to switch from wireless networks that allow faster downloads to slower ones.  — ED News Staff

August 15, 2008   [Web Exclusive]
Consumer Electronics Growth Tied To Better Design Coordination With Chip Suppliers
When it comes to designing new products, the consumer electronics (CE) and semiconductor sectors of the industry are going to have to get their acts together—literally, according to a joint study by the Consumer Electronics Association, the Global Semiconductor Alliance, and KPMG LLP, an audit, tax, and advisory firm. The study notes that CE producers are designing and developing their products much faster than IC suppliers can design the chips that drive them.  — Ron Schneiderman

August 14, 2008   [Web Exclusive]
A Summary Of The DDR Memory Controller Standard—Wait, There Isn’t One!
The number of SoCs that require an interface to off-chip memory is increasing. As a result, more and more designers are turning to DDR SDRAM interfaces such as DDR, DDR2, and DDR3 to address their low-cost, security of supply, storage capacity, and performance requirements. Fortunately for those designers, DRAMs have been standardized since the 1970s. But this still leaves a challenge that most SoC engineers don’t recognize until things start to go wrong.  — Graham Allan

August 14, 2008   [Electronic Design TOC Newsletter]
July 24, 2008
The 2008 Technolympics  — Staff

August 14, 2008   [Technology In The News]
NVIDIA Showing Fully Interactive GPU-Based Ray Tracer
NVIDIA is demonstrating what it says is the world’s first fully interactive graphics processing unit-based ray tracer this week at SIGGRAPH 2008 in Los Angeles. Based on NVIDIA GPU technology, the ray tracer shows linear-scaling rendering of a highly complex, two-million polygon, anti-aliased automotive styling application.  — ED News Staff

August 14, 2008   [Electronic Design TOC Newsletter]
August 14, 2008
SDR Transforms Amateur Radio  — Staff





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