25 April 2005
With the July 2006 date for implementation of the EU RoHS Directive little more than a year away, Soldertec Global is announcing another major lead-free electronics event.
The third International Conference on Lead-free Electronics, jointly sponsored by Soldertec Global and IPC, Association Connecting Electronics Industries, will be held at the Hotel Fira Palace in Barcelona, Spain on the 7th – 10th June 2005. The conference and workshop sessions will give a unique opportunity to learn about the latest research and developments in lead-free technology from keynote speakers from Europe, The Americas and Japan. The conference programme and registration form can be found on the Soldertec Global website: www.lead-free.org
Key industry experts will give presentations on the 8th and 9th June, including speakers from the UK Government Department of Trade & Industry IBM, Hewlett Packard, Solectron, and Lear Automotive. The supply chain is represented with papers from Cookson, Rohm & Haas, Henkel, Polyclad & Nihon Superior. Research papers are being presented by Osaka University, Fraunhofer, NPL, IVF & Warsaw University. Experts, such as Jennie Hwang, Asahi Technologies; Richard Kubin, E2open; Ning-Cheng Lee, Indium Corporation and Bob Willis, EPS, will also hold workshop sessions on the 7th and 10th June.
The first morning includes papers on ‘RoHS implementation and enforcement across the EU’, and ’Achieving RoHS Compliance and the Integrated Supply Chain’. Workshop topics include: ‘Lead Free Inspection, Process Control and Defect Elimination’ and `Electronic Material Declaration Standards to Support Eco-Compliance’.
“We have had an overwhelming response to our call for papers, not only from contributors across Europe, but also as far a field as Japan and the Americas. The EU RoHS Directive affects not only Europe but has far reaching implications for the global marketplace,” comments Kay Nimmo, Research Director at Soldertec Global. “This conference provides the ideal opportunity for production experiences from different regions of the world to be shared. We are certain that delegates will leave this conference well informed and full of ideas and confidence thanks to the high calibre presentations and workshops which will be given by industry experts.”
This Soldertec Global/IPC event always attracts a diverse audience from not just Europe but around the world. This year, with just one year to go before the legislative deadline, it is expected to be our biggest lead-free conference yet. The hotel is centrally located, close to both the sea front and the famous Ramblas.
-ENDS-
About Soldertec Global:
Soldertec Global is a membership based organisation focusing on research into soldering technology, including lead-free issues. It is part of the Materials Division of Tin Technology, a company supported by major tin producers and tin consuming industries worldwide and is at the cutting edge of research and development into tin based applications. This activity is organised through core projects, collaborative initiatives, or confidential contract research with individual member companies. Tin Technology is one of the world's foremost authority on tin with access to more than 60 years experience through its association with ITRI Ltd (formerly the International Tin Research Institute).
Soldertec Global members receive a unique package of benefits that aims to provide access to leading-edge lead-free research and information within a community of key electronics industry technologists. Members tap into over a decade of lead-free research that has been carried out by ITRI and its member consortium. The current research portfolio tackles key focus areas in lead-free technology. There are also opportunities for collaborative projects between the multi-level industry partners. Soldertec Global also aims to bring lead-free information directly to its members, with delivery mainly through this site http://www.lead-free.org
About IPC:
The IPC is a United States-based trade association dedicated to furthering the competitive excellence and financial success of its members worldwide; who are participants in the electronic interconnect industry. In pursuit of these objectives, the IPC will devote resources to management improvement and technology enhancement programs, the creation of relevant standards, protection of the environment, and pertinent government relations.
The IPC encourages the active participation of all its members in these activities and commits to full cooperation with all related national and international organizations. Networking is the cornerstone of IPC membership. Participants have unparalleled opportunities to network through workshops, conferences, semi-annual meetings and now electronically through new services that provide on-line communications for and between members.
In 1999, IPC changed its name from Institute of Interconnecting and Packaging Electronic Circuits to IPC. The new name is accompanied with an identity statement, Association Connecting Electronics Industries.
For editorial information, please contact:
Tom Perret
Soldertec Global
Tel: +44 (0)870 458 4242
Email: [email protected]
www.lead-free.org
Joanna Symons
PR Consultant
Tel: +44 (0)1344 360 367
Email: [email protected]