Make it low-power. Buying
off-the-shelf parts
to meet these criteria
is still a challenge, but
the latest crop of modules
makes the job easier.
Modules let designers develop custom
configurations with minimum moving the design of the critical aspects
of the system to the module vendors.
This includes the processor and memory
subsystem and usually most, if not all, of
the peripheral interface. A carrier board
typically contains connectors and devices
not found on the module, such as storage
or higher-performance video.
In many cases, vendors deliver a
range of modules for their own interface
standard, like Rabbit Semiconductor’s
RCM4300 RabbitCore (Fig. 1). It
includes a flash memory slot for removable
storage, 512 kbytes of SRAM, an
additional 1 Mbyte of SRAM, and 2
Mbytes of flash. The 100BaseT Ethernet
interface is on the module. Five serial
ports and a 12-bit, eight-channel analogto-
digital converter (ADC) are available
via a carrier board in addition to GPIO.
Small modules aren’t limited to
low-end micros. General Micro Systems’
GMS P70x packs the latest Intel
2.16-GHz Core 2 Duo into a 4- by 4-in.
package (see “Tiny Carrier And SBC Keep
Cool,” right).
Several module standards
do exist. COM
Express provides
support for PCI
Express and other
high-speed serial
interfaces (see
“COM Express: A
New Standard” at
www.electronicdesign.com, ED Online 8780).
The latest variation on the standard
introduces the
84- by 55-mm Nano form factor.
Check out MEN Micro’s XM50 for a
more rugged environment (see “Module
Targets Rugged Spec,” right). It is completely
encased, providing EMC protection
and conductive cooling. In terms of formfactor
size, it is similar to COM Express
SMALL STACKS
Keeping it small doesn’t necessarily mean
module/carrier combinations. Boston
Engineering’s 2.5- by 2.5-in. FlexStack
starts with a single-board computer
(SBC) based on Analog Devices’ 32-bit
Blackfin digital signal controller (Fig. 2).
The dual connector bus provides a rugged
stacking mechanism. The stack can
run uCLinux. It also supports National
Instruments’ LabVIEW. Even small packages
like FlexStack can utilize high-end
development tools.
For more mobile requirements and
prototypes, try the BUGbase from BugLabs
(see “Proto Heaven,”
ED Online 18089).
BUGbase has an
ARM135JF-S-based
microcontrol ler
plus sockets for Bug
modules, including
peripherals such as
LCDs and digital
cameras.
BOSTON
ENGINEERING
www.boston-engineering.com
RABBIT SEMICONDUCTOR
www.rabbitsemiconductor.com