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PICMG Consortium Releases New COM Express Design Guide

By ED News Staff

April 21, 2009

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Congatec AG (www.congatec.com), a leading supplier of embedded computer modules, has announced the immediate availability of Version 1.0 of the COM Express Design Guide for developers of COM Express modules. The Design Guide was revised by PICMG (PCI Industrial Computer Manufacturers Group, Inc.) over the last 18 months with the active collaboration of 15 companies. In addition to draft editor congatec, the following companies were involved: Adlink, Continuous Computing, Diversified Technology, Foxconn, GE Fanuc, Intel Corp., Kontron AG, MSC Vertriebs GmbH, NMS Communications, Nokia Siemens Networks, RadiSys, Trenton Technology, Tyco Electronics and VIA.

The design guide provides information on how to design custom system carrier boards for COM Express modules. This vendor-independent, 160-page guide includes a multitude of circuit examples that illustrate the correct implementation of all COM Express interfaces. Carrier boards designed on the basis of this guide are expected to enable greater interchangeability among COM Express modules from different vendors. The COM Express Design Guide is available for free download from the PICMG website at www.picmg.org/pdf/PICMG_COMDG_100.pdf.

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