Groomed for use by the folks at STI Electronics, Inc., the company’s complex,
ruggedized PC board meets the temperature, reliability, performance, vibration, and G-force requirements for space applications. A unique method of fabrication is said to be responsible for a double sided PC board with a single tier cavity on a 50 mil copper core. The single tier design allows users to wire bond a semiconductor module to the copper core, which in turn provides both heat dissipation and rigidity. For further information, call ENDICOTT INTERCONNECT TECHNOLOGIES INC., Endicott, NY. (866) 820-4820.