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Develop Seamless Interconnection Among Multiple General-Purpose Boards
Inter-chip communication solutions can be tricky. Schemes built around the XMOS Link look to simplify interconnections on the application-system and complex-system levels.
Date Posted: September 10, 2009 12:00 AM
The control thread instructs the DAC
what voltage to output, and it then retrieves
the actual voltage value from the ADC
in the MCU (Code List 3). Note how the
channel to the MCU is used identically to
the channel that goes to the DAC, which is
simply another thread on the XCore.
Data throughput from this software
implementation of the link was low—
around 10 kbits/s. Such a software link is
ideal for low-data-rate applications, such
as the example given. The capability also
wasn’t included in the MCU, which would
otherwise enable the use of multiple channel
ends. Thus, more than one simultaneous
connection is disallowed. This could be
added easily, though. On larger MCUs, the
XMOS system switch’s routing capabilities
could be added to the firmware, allowing
multiple XMOS Links on one device.
For some applications, an MCU isn’t the
right choice. Source is available for XMOS
Links in an FPGA at www.xlinkers.org/projects/xlink_fpga.
CONCLUSION
An XMOS Link provides a versatile
solution for inter-chip communications
and can be readily implemented on a standard
microcontroller. Its transition-based
nature and credit scheme allows for the
possibility of a low-speed link in software.
However, the link scales well to very high
data rates with minimal overhead. Crucially,
inter-chip connections located at
the application level are simple, and large
complex systems are able to be created
without difficulty.
All of the project source code can be
found on the Internet at www.xlinkers.org/node/306.
microcontrollers