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New Signal Chain Resources from Texas Instruments:

Ceramics For High-Power Packages

Date Posted: July 26, 2011 02:49 PM
Author: Jack Browne

Modern high-power RF semiconductors produce extremely high power densities, calling for packing materials with excellent thermal qualities to effectively dissipate the heat. Learn how to sort through different high-power package materials and how beryllium oxide (BeO) compares to other package material options.

Download the PDF here.

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