Last, but not least, is the technology roadmap of the Electronic Design
Automation industry. In fact, EDA suppliers are in even more of a catch-up
mode than the PWB industry. Driven by needs for semiconductor automation,
most of the original EDA roadmapping concerns focused on semiconductor
requirements, including modeling, simulation, and process identification.
There is no doubt that end-product applications are driven by microprocessors
and custom logic devices. Nevertheless, the EDA roadmap now recognizes
the need to more closely match the IPC and NEMI roadmaps, as EDA suppliers
must provide tools not just for IC design flows, but also for board-design
characterization.
As the industry approaches the 0.1-µm process for semiconductors,
designers must give more consideration to interconnect signal transfer,
noise margin, power leakage, and gigahertz signal speeds in the digital
designs. Printed-board designers presently work around the inadequacies
of existing systems, yet still can provide only marginal information to
the PWB manufacturer. Often, it comes down to several follow-up discussions
to pass on the complete product definition. Nevertheless, EDA companies
hope to provide the automation tools that help the IC designer and the
printed-board designer, as well as aid in the total simulation of a system
that deals with the process characterizations impacting performance of
the die.
The reason why roadmapping is so popular is that it works. The SIA roadmap
is often credited for pointing out the steps that industry needed to take
to win back world market share. In 1993, the IPC roadmap identified a
need for small via holes. Today there are 18 variations of methods to
produce microvias.
Working Together
In the electronics industry, OEMs send designs out to fabricators and
assemblers, providing the information needed to manufacture parts, thus
underscoring a need for standardized design tools and documentation. Standards
are often identified by the manufacturer and user, and as such, cross
industry lines. This means standards-writing organizations must follow
their lead.
In 1996, the industry worked together to develop J-STD-012, "Implementation
of Flip-Chip and Chip-Scale Technology." This standard, supported by the
Electronics Industries Association, IPC, JEDEC, MCNC, and Sematech, is
really more of a roadmap, showing where the industry needs to be. However,
it does identify standards that are necessary to achieve adequate communication
among users and manufacturers. J-STD-012 names 20 standards that cross
the boundaries of existing trade associations. Some examples of how semiconductor
and interconnection companies work together include:
* J-STD-026--Semiconductor Design Standard for Flip-Chip Applications
* J-STD-027--Mechanical Outline Standard for Flip-Chip/Chip-Scale Configurations
* J-STD-028--Performance Standard for Construction of Flip-Chip/Chip-Scale
Bumps
* J-STD-029--Test Method for Flip-Chip or Chip-Scale Products
* J-STD-030--Qualification and Performance of Underfill Materials for
Flip-Chip and Other Micro-Packages
While technology roadmapping can help to bring industries closer together,
it should be understood that while roadmapping identifies the challenges,
it does not necessarily provide the solutions. It is the cooperation needed
between different industries that will make those solutions a reality.
In order to accomplish this, industries need to work together on intellectual
property rights sharing. Participants in the development of electronic
equipment need to work together for the total industry that they serve.
Last, but not least, is the technology roadmap of the Electronic Design
Automation industry. In fact, EDA suppliers are in even more of a catch-up
mode than the PWB industry. Driven by needs for semiconductor automation,
most of the original EDA roadmapping concerns focused on semiconductor
requirements, including modeling, simulation, and process identification.
There is no doubt that end-product applications are driven by microprocessors
and custom logic devices. Nevertheless, the EDA roadmap now recognizes
the need to more closely match the IPC and NEMI roadmaps, as EDA suppliers
must provide tools not just for IC design flows, but also for board-design
characterization.
As the industry approaches the 0.1-µm process for semiconductors,
designers must give more consideration to interconnect signal transfer,
noise margin, power leakage, and gigahertz signal speeds in the digital
designs. Printed-board designers presently work around the inadequacies
of existing systems, yet still can provide only marginal information to
the PWB manufacturer. Often, it comes down to several follow-up discussions
to pass on the complete product definition. Nevertheless, EDA companies
hope to provide the automation tools that help the IC designer and the
printed-board designer, as well as aid in the total simulation of a system
that deals with the process characterizations impacting performance of
the die.
The reason why roadmapping is so popular is that it works. The SIA roadmap
is often credited for pointing out the steps that industry needed to take
to win back world market share. In 1993, the IPC roadmap identified a
need for small via holes. Today there are 18 variations of methods to
produce microvias.
Working Together
In the electronics industry, OEMs send designs out to fabricators and
assemblers, providing the information needed to manufacture parts, thus
underscoring a need for standardized design tools and documentation. Standards
are often identified by the manufacturer and user, and as such, cross
industry lines. This means standards-writing organizations must follow
their lead.
In 1996, the industry worked together to develop J-STD-012, "Implementation
of Flip-Chip and Chip-Scale Technology." This standard, supported by the
Electronics Industries Association, IPC, JEDEC, MCNC, and Sematech, is
really more of a roadmap, showing where the industry needs to be. However,
it does identify standards that are necessary to achieve adequate communication
among users and manufacturers. J-STD-012 names 20 standards that cross
the boundaries of existing trade associations. Some examples of how semiconductor
and interconnection companies work together include:
* J-STD-026--Semiconductor Design Standard for Flip-Chip Applications
* J-STD-027--Mechanical Outline Standard for Flip-Chip/Chip-Scale Configurations
* J-STD-028--Performance Standard for Construction of Flip-Chip/Chip-Scale
Bumps
* J-STD-029--Test Method for Flip-Chip or Chip-Scale Products
* J-STD-030--Qualification and Performance of Underfill Materials for
Flip-Chip and Other Micro-Packages
While technology roadmapping can help to bring industries closer together,
it should be understood that while roadmapping identifies the challenges,
it does not necessarily provide the solutions. It is the cooperation needed
between different industries that will make those solutions a reality.
In order to accomplish this, industries need to work together on intellectual
property rights sharing. Participants in the development of electronic
equipment need to work together for the total industry that they serve.