A recent addition, the company’s deposition chamber enables the uniform
application of thin film resistor materials in layers as thin as 1,000 Angstroms onto silicon or ceramic substrates. Additionally, resistor networks produced in the chamber meet MIL-R-83401. As per the company, the chamber uses a physical vapor deposition process to deposit thin-film materials onto the substrates with uniform thickness. It also improves both the throughput of the manufacturing line as well as consistency of the resistor network elements, resulting in higher device stability and shorter lead times. Typical applications for the thin film resistor networks include instrumentation amplifiers, precision voltage dividers, precision analog circuits, measurement bridge and low noise circuitry, ladder networks, and converter applications. BI TECHNOLOGIES, Fullerton, CA. (714) 447-2759.