The M2 series of modular 19-in. cabinet enclosures from Optima EPS balances
light weight and ruggedness. The aluminum-frame enclosures come in 52-to 77-in.
heights and depths to 42 in., and they're configurable in multibay systems.
The series conforms to MILSTD-810F for a deployed transportation environment.
Customers can specify the M2 series to various levels of ruggedness, depending
on their application. Heavy-duty single or double-walled extrusions, internal
reinforcing corner keys, four-way crimped and welded corner sockets and corner
members create a tough and reliable environment. For additional security, the
enclosures sport rugged front-to-back stiffeners and cross bracing and optional
7-gauge welded steel base, extra thick rails, and ceiling or wall bracing. The
bolt-down base allows universal hard-mounting to the floor.
The enclosure is very customizable. Customers can choose from a wide range
of industry-standard sizes, cabling, cooling, and power options. Lead time is
two weeks. Contact the company for prices.
Optima, an Elma Company
www.optimaeps.com/modular_m2.htm
NEWS IN BRIEF: MATERIALS
Researchers in the Microelectronics Technologies division at Rohm and Hass Electronic
Materials have successfully optimized copper plating additives, enabling customers
to "dial in" specific amounts of dopants into ultra-pure copper films. The technology
in the Ultrafill 4000 series of levelers and suppressors targets interconnect
metallization at the sub-65-nm node. The result is improved via stress migration
(VSM) in the L-4000 series of levelers. In the suppressor area, the technology's
superior wetting capabilities provide improved gap filling on thin copper seed
layers and therefore enhance reliability for both logic and memory processes,
according to the company. For more information, go to www.electronicmaterials.rohmhaas.com
New lead-and cadmium-free photovoltaic materials from Ferro Electronic Material
Systems will deliver better performance in solar cell applications using silicon
wafers less than 180 µm thick. By comparison, current-generation "thin"
wafers are 240 µm thick. The material employs a novel aluminum, rear silver,
front silver metallization system. The metallizations provide improved electrical
performance and can contact emitters with sheet resistivity of 50 to 70 Ω per
square. For further details, go to www.ferro.com
Gap Pad 5000S35 from the Berquist Co. is a fiberglass-reinforced filler and
polymer featuring a high thermal conductivity. The material exhibits extremely
soft characteristics (S-class) while maintaining elasticity and conformability.
The fiberglass reinforcement offers easy handling and converting, added electrical
isolation, and resistance to punctures, shearing, and tears. The inherent natural
tack on both sides assists in application and permits the product to effectively
fill air gaps, enhancing the overall thermal performance. Thermal conductivity
is 5 W/m-K. The overall result is high performance at low mounting pressures.
Contact the company for price and availability. Visit www.bergquistcompany.com
for additional information about the Gap Pad 5000S35.
See Associated Figure
See Associated Table