Claiming to be the slimmest such component available, the company’s latest line of
integrated fansinks are available in copper and aluminum and consist of a pin-fin heatsink and a fan that is embedded into the heatsink’s pin array. This configuration allegedly allows for the creation of extremely low profile active cooling solutions. The components are available with a minimum overall height of 0.42” to a maximum overall height of 0.63”, making them suitable for use in single-slot PCI Express and ATCA applications. Additionally, they range in footprint from 1.81" x 1.81" to 4.10" x 2.05" and come with a high-reliability bracket fan (6.1 cfm/12V/0.2A). For more details and pricing, call
Cool Innovations Inc., Ontario, Canada. (905) 760-1992.