The Autoheader right-angle interconnects () suit applications that require solder-free, lead-free assembly in
space-restricted, rugged environments, like stacked
printed-circuit boards (PCBs), junction-box assemblies, and automotive connector modules and switches. They come in
a variety of pin-header configurations to meet specific assembly
requirements. Both single- and dual-row formats are available to
ensure flexibility for higher interconnect densities.
The devices' proven "eye-of-the-needle" AutoPliant technology has undergone extensive qualification testing for
automotive applications. Key
test parameters included thermal shock, mechanical shock
and vibration, and temperature and humidity cycling,
using criteria based on the
SAE/USCAR2 Rev. 4 and IEC 60352-5 standards. The interconnects significantly exceeded retention-force requirements and
maintained a consistent gas-tight fit under adverse conditions.
Autosplice • www.autosplice.com
Packaging
The Thin-Substrate Chip-Scale Package (tsCSP) from Amkor Technology is a land-grid-array, multi-row package (up to three
rows) compatible with established CSP mounting techniques. The
near chip-size standard outlines of the tsCSP offer a broad selection of land pitch, count, and body sizes. The use of a thin substrate delivers a standard height of 0.4 to 0.6 mm. An ultra-thin
version with a thickness as small as 0.25 mm is also available.
The company's exposed die attach-pad technology enhances the
tsCSP's thermal performance. Visit www.amkor.com.
A slide-motion button on the second-generation ATCA handle from Elma Electronic latches the handle shut and activates an
optional micro-switch. Closed, the handle is flush against the
panel to prevent inadvertent opening prior to micro-switch activation. Moving the sliding button activates the micro-switch and
unlatches the handle so it pivots out by a few degrees and presents itself for removal. Prices start under $2.00 in high volumes,
with a lead time of stock to two weeks. See www.elma.com.
Corwil Technology Corp. is providing additional services for its system-in-package (SIP) and multi-component packaging (MCP)
module customers. The company has teamed with substrate
design and fabrication sources to deliver complete, turnkey SIP
module design, substrate fabrication, and packaging services.
Other capabilities include wafer thinning and dicing, inspection,
wire bonding, flip-chip and surface-mount technology assembly,
and encapsulation. To learn more, go to www.corwil.com.
|
Focus on Interconnects |
Company |
Model/Type |
Description |
Pricing |
FCI
www.fciconnect.com |
AirMax VS connector system |
New ball-grid-array termination option for shieldless high-speed connector; reduces PCB pricing
layer count and cost; lowers insertion loss and improves impedance matching |
Contact the company for pricing |
Aries Electronics Inc.
www.arieselec.com |
Correct-A-Chip adapter |
RoHS-compliant version of 20-pin plastic-leadless-chip-carrier, IC-to-16-pin dual-inline-package adapter; slight offset avoids typical bypass capacity placement; max operating
temperature is 105°C |
$6.17 each in quantities of 500 |
Molex
www.molex.com |
microSD memory-card connector |
Saves 70% of the space versus miniSD versions; brake tabs slow card during
connector extraction; detect switch identifies card insertion; versions as small as 1.80 mm high,15.50 mm deep |
$0.70 in quantities of 10,000 to 50,000 |
MTL
www.mtl-fieldbus.com |
9311-FB fieldbus barrier wiring hub |
Field-mounted unit creates intrinsically safe spur connections from non-intrinsically safe trunk; bus powered; intelligent power
management; flexible grounding options;
–40°C to 75°C operating range |
Contact the company for pricing |
Advanced Interconnections Corp
www.advanced.com |
B2B high-density surface-mount connector |
Robust screw-machined terminals for 1.27-mm-pitch, surface-mount board stacking use; multi-finger contacts; polarized male/female
engagement prevents 180° mismating;
RoHS-compliant |
Contact the company for pricing |