Component Suppliers for the iPhone 3G Based on Physical Teardown
Preliminary Table provided by iSuppli Corp.
| Supplier |
Component Description |
| Source Unidentifiable |
Display |
| Source Unidentifiable |
Touchscreen |
| Toshiba Semiconductor |
NAND Flash Memory, 8 GBbyte |
| Infineon |
Baseband: HSDPA/WCDMA/EDGE, Dual ARM926 & ARM7Core |
| Samsung Semiconductor |
Application Processor |
| Source Unidentifiable |
Camera Module |
| Micron Technology |
Image Sensor: 2 Megapixel; CMOS |
| Murata |
Contains Marvell 88W8686 WLAN; CSR BC6 ROM Bluetooth |
| Samsung Semiconductor |
SDRAM: Mobile DDR, 1 Gbit |
| Source Unidentifiable |
Battery |
| Infineon |
RF Transceiver: Quad-Band GSM/EDGE, Tri-Band WCDMA/HSDPA, 130-nm RF CMOS |
| Numonyx |
128-Mbit NOR Flash; 64-Mbit pSRAM |
| Infineon |
GPS Receiver: Single Chip |
| Infineon |
Power Management IC: Phone |
| NXP Semiconductors |
Power Management IC: Applications Processor |
| Broadcom |
Multitouch Controller |
| Wolfson Microelectronics |
Audio Codec |
| Skyworks |
Power Amplifier: Quad-Band GSM/EDGE |
| STMicroelectronics |
Accelerometer: Microelectromechanical |
| TriQuint Semiconductor |
Power Amplifer Module (PAM): WCDMA/HSUPA |
| TriQuint Semiconductor |
PAM: WCDMA/HSUPA |
| TriQuint Semiconductor |
PAM: WCDMA/HSUPA |
| National Semiconductor |
Mobile Pixel Link: 24-Bit RGB Display Interface Serializer |
| Linear Technology |
Battery Charger: USB Compatible |
| Linear Technology |
DC-DC Converter - Synchronous Boost |
| Infineon |
Amplifier: LNA, Tri-Band HSDPA |
| Silicon Storage Technology |
Flash: NOR, 8 Mbit |
| Infineon |
Amplifier - LNA, GPS |
| Linear Technology |
Regulator: Switching |
| Maxim |
Analog IC |