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Single-Layer/Multilayer Chip Capacitors Give A Lift At Microwave Levels


Roger Allan

November 15, 2004

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When working at microwave frequencies, the smaller the capacitor, the better. That's just the case with the CLB and CLG series of single-layer ceramic capacitors and the GMA series of multilayer ceramic capacitors. Crafted by Murata, they minimize package size and improve performance at these frequencies.

All three series, which include gold terminations for wire and die bonding, are well suited for high-density mounting applications. Mounting can be done by wire bonding via gold wires and die bonding using gold-tin solder.

For the CLB series, typical chip size ranges from 0.25 by 0.25 by 035 in. to 0.9 by 0.9 by 0.35 in. Capacitance ranges from 2 to 390 pF (0.1 to 4300 pF is also available) at a temperature coefficient as low as ±10% (from ­25°C to 85°C). Working voltage is rated at 100 V.

For the CLG series, typical chip size ranges from 0.5 by 0.5 by 0.25 in. to 0.9 by 0.9 by 0.25 in. Capacitance ranges from 33 to 20 pF (as low as 0.5 pF is also available) at a temperature coefficient down to ±10% (from ­25°C to 85°C). Working voltage is rated at 100 V.

Capacitors in the top-of-the line GMA series are available in three chip sizes: 0.38 by 0.38 by 0.3 in., 0.5 by 0.5 by 0.35 in., and 0.8 by 0.8 by 0.5 in. Capacitance ranges from 0.01 mF to 68000 pF, depending on working voltage (6.3, 10, 16, 50, and 100 V) and temperature-coefficient characteristics (X5R, X7R, Y5R, and Y5V).

All three series are available now. Prices range from $0.20 to $1 each, depending on size, series type, capacitance value, and quantities purchased.

Murata Electronics North America
www.murata.com
(770) 433-5782

When working at microwave frequencies, the smaller the capacitor, the better. That's just the case with the CLB and CLG series of single-layer ceramic capacitors and the GMA series of multilayer ceramic capacitors. Crafted by Murata, they minimize package size and improve performance at these frequencies.

All three series, which include gold terminations for wire and die bonding, are well suited for high-density mounting applications. Mounting can be done by wire bonding via gold wires and die bonding using gold-tin solder.

For the CLB series, typical chip size ranges from 0.25 by 0.25 by 035 in. to 0.9 by 0.9 by 0.35 in. Capacitance ranges from 2 to 390 pF (0.1 to 4300 pF is also available) at a temperature coefficient as low as ±10% (from ­25°C to 85°C). Working voltage is rated at 100 V.

For the CLG series, typical chip size ranges from 0.5 by 0.5 by 0.25 in. to 0.9 by 0.9 by 0.25 in. Capacitance ranges from 33 to 20 pF (as low as 0.5 pF is also available) at a temperature coefficient down to ±10% (from ­25°C to 85°C). Working voltage is rated at 100 V.

Capacitors in the top-of-the line GMA series are available in three chip sizes: 0.38 by 0.38 by 0.3 in., 0.5 by 0.5 by 0.35 in., and 0.8 by 0.8 by 0.5 in. Capacitance ranges from 0.01 mF to 68000 pF, depending on working voltage (6.3, 10, 16, 50, and 100 V) and temperature-coefficient characteristics (X5R, X7R, Y5R, and Y5V).

All three series are available now. Prices range from $0.20 to $1 each, depending on size, series type, capacitance value, and quantities purchased.

Murata Electronics North America
www.murata.com
(770) 433-5782

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