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» Table 3: Socket (Module) Versus Chip On Board Tradeoffs
Channels
Analog & Mixed Signal
Amplifiers
Data Converters
Discrete semiconductors
Controllers
Analog Switches
Power
Regulators
Discrete semiconductors
Drivers
Protection ICs
Power management/ controller ICs
DC/DC converters
Battery ICs
Charge Pumps
Power Quality
High Voltage Converters
One Powerful Day
Digital
Processors/Controllers
Video ICs
Audio ICs
Programmable Logic Devices
Standard Logic
Memory
System on Chip (SoC)
Interface ICs
Lab Bench
Communications
Wireless
Wired
Fiber Optics
Components
Cabinets
Enclosures
Cooling Products
Displays
Interconnects
Wire & Cable
Motors
Passive Components
Power Sources
Sensors
Transducers
Switches
Relays
Solenoids
Input Devices
Timing Devices
Circuit Protection Devices
Output Devices
MEMS
Packaging
Indicators & Lighting
LEDs and Solid State Lighting
Test & Measurement
Digital Signal Oscilloscopes (DSOs)
Logic Analyzers
Spectrum Analyzers
Communications Test Equipment
Bench-top Power Supplies
Meters (Includes DMMs, voltmeters, etc.)
PC-Based Instruments
EMI/EMC Test Equipment
Test & Measurement Accessories (probe, etc.)
Emulators/Debuggers (Hardware)
JTAG
Automated Test Equipment (ATE)
Test Bench/Test Executive Software
Instrument GUIs (O-scopes, logic analyzers, etc.)
EDA
Computer-Aided Engineering (CAE) Tools
PCB and MCM layout tools
IC physical design and verification tools
Embedded
Development Tools
Programming Languages
Operating Systems
Frameworks
Protocol Stacks
Middleware
Boards, Modules & Systems
Bill's Workbench
Embedded In ED
Part Inventory
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Table 3: Socket (Module) Versus Chip On-Board Tradeoffs
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Daniel Harris
May 24, 2007
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