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EDA Alert: January 4, 2005

By David Maliniak

January 04, 2005

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============================================


EDA Alert e-Newsletter
PlanetEE - www.planetee.com
Electronic Design - www.elecdesign.com
Jan. 4, 2005

=======================================



Today's Table of Contents:
1. Viewpoint Exclusive -- Electronic System-Level Design Is Ready: Are
You?
2. 90-nm Process Achieves Volume Production
3. Tool Predicts Components' Thermal Performance
4. Papers Sought On UML for SoC Design
5. Memory Equivalency Checker Speeds Time-To-Results
6. Happenings
- ACM/IEEE Asia and South Pacific Design Automation Conference
(ASPDAC 2005)
- DesignCon 2005
- Design & Verification Conference (DVCon 2005)
- International Symposium on Field-Programmable Gate Arrays
(FPGA 2005)

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******************************************************************

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Electronic Design's Quick Poll ==> http://lists.planetee.com/cgi-bin3/DM/y/eipx0DJhTw0BSK0BGmZ0Ar

************

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Register now:
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************
SUBSCRIBE ONLINE TO ELECTRONIC DESIGN
If you're reading this e-newsletter, then you are either a current
Electronic Design subscriber, or should be (145,000 of your peers are).
To apply for or renew a subscription to Electronic Design absolutely
FREE and without paperwork or hassle, click on the link below.

Electronic Design subscription ==> http://lists.planetee.com/cgi-bin3/DM/y/eipx0DJhTw0BSK0BEE30AW

************
1. Viewpoint -- Exclusive to EDA Alert
************
Electronic System-Level Design Is Ready: Are You?

Graham Hellestrand, Founder
VaST Systems Technology, Sunnyvale, CA



Does it make sense to spend six months designing a complex system
architecture only to throw it away and start all over again in RTL? Of
course, you'll then have to do from one to three chip re-spins to
finally get it right. Why do so many companies think that this is
"normal," "the way it has always been" and "inevitable," like gravity or
the coming of winter?



Architects and designers should be having a fit over this waste of their
talent and time, and immediately demand electronic system-level (ESL)
design platforms. While ESL is still young, the last few years have seen
truly production-worthy tools come to market. For example, today it is
both possible and productive to model complex SoC architecture in
software. This will create a virtual system prototype that you can use
to begin hardware and software development in parallel and enable true
co-verification. So why are so few people taking advantage of this next
level of design abstraction?



The problem is not that there's a lack of technology; it's that people
are notoriously slow to adopt new methods and tools. One wag once
recommended that people should "stop waiting for the future and become
part of the 10% that are already living in it." That's very true. With
every advance, 10% of the population always leads the rest by five to
ten years. In the case of EDA tools, we observed this phenomenon with
the adoption of simulation and formal verification. Our
great-grandparents observed the change from horses to automobiles and
currently, as 10% of the population moves happily to taking digital
pictures with their cell phones, the rest of us still run to the drug
store to have pictures developed that will end up in a box in the
garage. The good news is that you don't have to be part of the 90% who
eventually catch on -- you can be among the 10% operating in the future
today.



The first step is to take a look at the ESL solutions with a successful
track record in production environments. Solutions should have the
following attributes:



* Actually have been used in production for multiple years.
* Successfully have taped out real chips and brought real systems to
market.
* Reduced the need for point tools (i.e., the solution can be used by
architects as well as software and/or hardware designers).
* Facilitated hardware/software co-design and co-verification.
* Improved technical communications between team members, customers and
suppliers, and geographically distributed development teams.
* Supported architecture and design reuse at the system and block level.
* Helped design teams achieve significant, measurable reduction in cost
and time-to-market after users become proficient.



Once you've done your technical assessment, projected and compared cost
and time reductions, and picked your favorite, then set up a pilot or
shadow project and get going. Yes, be rigorous; yes, measure actual
results; yes, factor in the cost of retraining and retooling. But for
heaven's sake, get moving. ESL is ready. Are you?

Contact Graham Hellestrand at: mailto:g.hellestrand@vastsystems.com

To comment on this Viewpoint, go to Reader Comments at the foot of the
Web page:
EDA Alert ==>
http://lists.planetee.com/cgi-bin3/DM/y/eipx0DJhTw0BSK0BN2g0AE

*******
2. News
*******
90-nm Process Achieves Volume Production

TSMC reports that its Nexsys 90-nm process continues to ramp up in
volume. Production reached several thousand 300-mm wafers/month in the
fourth quarter of 2004 and will ramp to higher volumes in 2005. The
Nexsys 90-nm process features copper interconnect, low-k dielectrics,
and 12-in. wafer production as standard. It offers a 2X gate density
improvement, 35% greater speed, 60% gains in active power savings, and a
20% RC interconnect improvement when compared with TSMC's 130-nm
process.

Almost 40 single-product mask sets were taped out in 2004; 30 more
products taped out on mask-sharing Cybershuttle wafers. TSMC is
delivering 90-nm products to Altera Corp., with all six members of the
Stratix II FPGA family due to be verified for production by the end of
2004. Other users of the process include Qualcomm and various integrated
device manufacturers.

TSMC ==> http://lists.planetee.com/cgi-bin3/DM/y/eipx0DJhTw0BSK05z20A1

*******
3. News
*******
Tool Predicts Components' Thermal Performance

Support for the new JEDEC thermal-testing standard is offered by version
5 of Flomerics' Web-based Flopack software. The tool creates Delphi
compact models that predict the performance of electronic components
under the soon-to-be-published standard from JEDEC committee JC-15.1.
The behavioral models can predict the temperature of component packages
at critical points, such as the junction, case, and board, and do so in
less time than when using conventional detailed package models.

Flopack consists of a collection of "smart part" modules installed on a
central web server. Via a standard browser, users enter data describing
the IC package through simple forms. Parameters such as the number of
solder balls, die size, power, substrate metal layer stackup, and
coverage are used to generate a Flotherm simulation model with built-in
adherence to the JEDEC thermal-modeling standards.

Flomerics ==> http://lists.planetee.com/cgi-bin3/DM/y/eipx0DJhTw0BSK0BAsd0A2

*******
4. News
*******
Papers Sought On UML for SoC Design

Organizers of the second international workshop on the Unified Modeling
Language (UML) 2.0 for SoC design are looking for presentations
describing recent relevant design projects. The UML-SOC '05 Workshop,
co-located with the 42nd Design Automation Conference (DAC) in Anaheim,
Calif., will take place on Sunday, June 12 from 9 am to 5 pm. It's
intended to initiate discussion and to exchange experiences and
information regarding UML and its application to SoC design and general
hardware-related aspects.

Extended abstracts are due by January 31 to workshop organizers Luciano
Lavagno ( mailto:luciano@cadence.com ) of Cadence Berkeley Labs and
Wolfgang Mueller ( mailto:wolfgang@acm.org ) of Paderborn University.
For more information or to view presentations from the first workshop,
visit: http://lists.planetee.com/cgi-bin3/DM/y/eipx0DJhTw0BSK0BN2h0AF

DAC ==> http://lists.planetee.com/cgi-bin3/DM/y/eipx0DJhTw0BSK0paP0A5

*******
5. News
*******
Memory Equivalency Checker Speeds Time-To-Results

In standardizing Synopsys' ESP full-custom memory equivalency checker
for its low-power, high-density Metro Platform memories, ARM's Artisan
Components was able to verify its memory generators. On top of that, the
company realized a 5X reduction in time-to-results over verification
with simulation only. ESP thoroughly and quickly compares a Verilog
simulation model directly against the corresponding HSpice netlist.

ARM ==> http://lists.planetee.com/cgi-bin3/DM/y/eipx0DJhTw0BSK0BBjL0AV
Synopsys ==> http://lists.planetee.com/cgi-bin3/DM/y/eipx0DJhTw0BSK05z30A2

**************
6. Happenings
**************

ACM/IEEE Asia and South Pacific Design Automation Conference (ASPDAC
2005)
Hotel Equatorial, Shanghai, China
January 18-21, 2005
http://lists.planetee.com/cgi-bin3/DM/y/eipx0DJhTw0BSK0BNPu0Aw

DesignCon 2005
Santa Clara Convention Center, Santa Clara, Calif.
January 31-February 3, 2005
http://lists.planetee.com/cgi-bin3/DM/y/eipx0DJhTw0BSK0BNil0AE

Design & Verification Conference (DVCon 2005)
Doubletree Hotel, San Jose, Calif.
Feb. 14-16, 2005
http://lists.planetee.com/cgi-bin3/DM/y/eipx0DJhTw0BSK05co0Ae

International Symposium on Field-Programmable Gate Arrays (FPGA 2005)
Hyatt Regency Hotel, Monterey, Calif.
Feb. 20-22, 2005
http://lists.planetee.com/cgi-bin3/DM/y/eipx0DJhTw0BSK0BN2i0AG
*****************************************************************

EDA ALERT e-NEWSLETTER CONTACTS

===============================


EDA Technology Editor, Electronic Design: David Maliniak
mailto:dmaliniak@penton.com

Advertising/Sponsorship Opportunities: Bill Baumann
mailto:bbaumann@penton.com

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===============================
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