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| EDA Alert e-Newsletter |
May 6, 2008
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Live date – Weds June 11th at 2:00pm ET
Hosted by: Electronic Design
Sponsored by: Micro Power & Panasonic
Aftermarket Battery Packs - Revelations from Product Tear-Downs
Aftermarket battery packs are available for most portable devices. This
webcast presents the results of several product tear-downs on
aftermarket battery packs, and explains how substandard aftermarket
packs can cut corners on cost, safety mechanisms, and battery
performance. These tear-downs expose electronic & mechanical design
issues, as well as good manufacturing and regulatory violations. Then,
this webcast provides solutions for OEMs to manage and control their
ecosystem of aftermarket battery pack suppliers. This webcast is
applicable to OEMs of consumer and industrial electronic products
susceptible to aftermarket batteries, such as medical, handheld radio,
and data collection devices.
Register here
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Software Rules The Day In Multicore SoC
Design
By David Maliniak, EDA Editor
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Looking back over the past 10 years or so, semiconductor process
technology more or less kept pace with the demand for functionality in
large-scale processor-based ICs. When the next-generation set-top box IC
needed more horsepower, a move from, say, a 180-nm process to 130 nm
would provide the necessary boost by adding gates and the ability to run
faster clocks. But that next-generation chip would still carry a single
processor. Things have changed dramatically in the last few years.
Simply put, silicon scaling no longer meets functionality requirements.
Read the
full article...
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There was a ton of announcements made at the Embedded Systems
Conference earlier this month. Check out the highlights, exclusive
commentary, and footage from the show by Electronic Design's
Editor-in-Chief Joe Desposito on our Web page, sponsored by Lantronix,
Xilinx, and Altium. You can also find video interviews by Electronic
Design Europe's Editor-in-Chief Paul Whytock here.
International
Electronics Forum Asks "Revolution Or Evolution?"
The International Electronics Forum (IEF) has established itself as an
event for senior-level personnel who need to understand the way the
semiconductor industry sees the future unfolding. Future Horizons, a
global semiconductor analyst company, is hosting the 17th IEF under the
auspices of the Dubai Silicon Oasis Authority at the Madinat Jumeirah,
Dubai, May 7-9. The theme of this year’s conference is "Revolution or
Evolution."
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Intelligent DAQ is multifunction data acquisition that features
user-defined, on-board processing for complete flexibility of system
timing and triggering. Instead of a fixed ASIC for controlling device
functionality, intelligent DAQ uses an FPGA-based system-timing
controller to make all analog and digital I/O configurable for
application-specific operation. You can configure the FPGA chip by
creating LabVIEW block diagrams with the National Instruments LabVIEW
FPGA Module. National Instrument's Vineet Aggarwal demonstrates this
functionality with a new vocoder application and some excellent
beatboxing skills.
Want an Amazon Kindle eBook Reader? Take The Engineering
TV Quiz . . .
Been tuning into Engineering TV lately? Engineering TV created a
quiz to test your knowledge, and sponsor DigiKey Corporation has put an
Amazon Kindle eBook Reader up for grabs for the contest. Answer the
short quiz to throw your name into the hat for this hot item. Haven't
been watching Engineering TV? That's alright. You can still enter to win
the prize. But the contest will close on May 9, so don't delay.
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Tool Ferrets Out Analog/RF Circuit
Noise
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Device noise is insidious to gigahertz, nanometer-scale analog, and
RF CMOS circuit performance. In the past, it’s been either impractical
or outright impossible to perform transistor-level analysis of the
impact of device noise for many complex analog and RF circuits,
including sigma-delta ADCs, video DACs, fractional-N PLLs, frequency
synthesizers, and wideband VCOs.
Read the
full article...
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SoC/ASIC Verification System Is Fast And
Scalable
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Targeting SoC/ASIC developers of projects from 3 Mgates to 180
Mgates, the latest generation of GiDEL’s PROC_SoC Verification System
doubles the capacity offered by previous versions by incorporating
Altera’s Stratix III EP3SL40 FPGAs.
Read the
full article...
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Enhancements Perk Up Spice Tool Suite
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The latest release of Intusoft’s ICAP/4 Spice-simulation suite
includes enhancements in waveform-creation capabilities as well as in
automated component conversions. Build 3247 of ICAP/4 8.x.11 is also
reported as having had the fewest bugs in Intusoft’s history during
the company’s testing cycle on the revision.
Read the
full article...
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3D EM-Field Simulator Goes Through
Upgrade
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Version 11.1 of Ansoft’s HFSS software for 3D full-wave
electromagnetic field simulation is now available, offering a number of
new enhancements. The tool now offers meshing as well as model
resolution and validation features. It supports Nastran (.nas) geometry
import as well as Parasolid and Unigraphic geometry import (the latter
under Windows only). It also offers enhanced post-processing features.
Read the
full article...
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providers (ISPs) monitoring your surfing habits?
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