Siva Gurrum

Siva
P.
Gurrum
Member, Group Technical Staff,
Texas Instruments

 

Siva P. Gurrum is a member of the Group Technical Staff at Texas Instruments. He received his BTech degree in 1999 from the Indian Institute of Technology, Madras, his MS in 2001 from the University of Maryland at College Park, and his PhD in 2006 from Georgia Institute of Technology, all in mechanical engineering. At TI, he has worked on thermal and thermo-mechanical analysis for semiconductor packages including modeling and characterization. He also has authored and coauthored more than 20 papers, has written one book chapter, and holds five U.S. patents. He can be reached at sgurrum@ti.com.

Articles
Mechanical Modeling Advances Improve Semiconductor Packaging
3D simulations can now address package warpage, interface delamination, and moisture-induced impact to failures.
Commentaries and Blogs
Guest Blogs
Jun 30, 2015
Commentary

Four-Wire Sensing Can Make or Break Your Measurements 7

Erroneously implementing four-wire sensing into a measurement instrument can be disastrous, so it becomes critical to have a firm grasp of how sense lines function....More
May 29, 2015
blog

Engineering Education: Fact and Fiction 5

I have taken a keen interest in the dialogue (that has been going on for many years) about the quality of engineering education in the U.S....More
May 1, 2015
blog

Transition from the Academe to the Industry Unraveled (Part 2) 4

Some few months ago, I wrote an article contrasting academe and work life as well as the adjustments and precautions that had to be made by a typical fresh graduate......More

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