Siva Gurrum

Siva
P.
Gurrum
Member, Group Technical Staff,
Texas Instruments

 

Siva P. Gurrum is a member of the Group Technical Staff at Texas Instruments. He received his BTech degree in 1999 from the Indian Institute of Technology, Madras, his MS in 2001 from the University of Maryland at College Park, and his PhD in 2006 from Georgia Institute of Technology, all in mechanical engineering. At TI, he has worked on thermal and thermo-mechanical analysis for semiconductor packages including modeling and characterization. He also has authored and coauthored more than 20 papers, has written one book chapter, and holds five U.S. patents. He can be reached at sgurrum@ti.com.

Articles
Mechanical Modeling Advances Improve Semiconductor Packaging
3D simulations can now address package warpage, interface delamination, and moisture-induced impact to failures.
Commentaries and Blogs
Guest Blogs
May 1, 2015
blog

Transition from the Academe to the Industry Unraveled (Part 2) 2

Some few months ago, I wrote an article contrasting academe and work life as well as the adjustments and precautions that had to be made by a typical fresh graduate......More
Mar 6, 2015
blog

Programming Efficiency: Part 2 2

A number of years ago I did some work on a PABX. The device was electromechanical and far from state of the art, but the owner had been talked into spending a bunch of money expanding it and couldn’t justify scrapping it....More
Jan 21, 2015
Commentary

How To Dumb Down Smart Electronics 9

In our generation of microcontroller-enhanced everything, it has been frustrating at best to see how often the capability of smart hardware has been foiled by the design of poorly purposed software....More

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