Siva Gurrum

Siva
P.
Gurrum
Member, Group Technical Staff,
Texas Instruments

 

Siva P. Gurrum is a member of the Group Technical Staff at Texas Instruments. He received his BTech degree in 1999 from the Indian Institute of Technology, Madras, his MS in 2001 from the University of Maryland at College Park, and his PhD in 2006 from Georgia Institute of Technology, all in mechanical engineering. At TI, he has worked on thermal and thermo-mechanical analysis for semiconductor packages including modeling and characterization. He also has authored and coauthored more than 20 papers, has written one book chapter, and holds five U.S. patents. He can be reached at sgurrum@ti.com.

Articles
Mechanical Modeling Advances Improve Semiconductor Packaging
3D simulations can now address package warpage, interface delamination, and moisture-induced impact to failures.
Commentaries and Blogs
Guest Blogs
Apr 8, 2016
Commentary

Confabbing on the Fabless Fad 1

High capital and maintenance costs, and EDA advances along with abstractions to deal with chip complexity, have been leading contributors to the fabless migration....More
Mar 2, 2016
Article

Home or Very Small Office Electronic Circuit Prototypes, Part 4 10

Part 4 focuses on testing for a reflow oven and build of a mixed SMT/through-hole board....More
Jan 4, 2016
blog

Building Home or Very Small Office Electronic Circuit Prototypes, Part 3 20

Part 3 delves into critical equipment for testing today's electronics, and provides updates on circuit-board designs from Part 1....More

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