Siva Gurrum

Siva
P.
Gurrum
Member, Group Technical Staff,
Texas Instruments

 

Siva P. Gurrum is a member of the Group Technical Staff at Texas Instruments. He received his BTech degree in 1999 from the Indian Institute of Technology, Madras, his MS in 2001 from the University of Maryland at College Park, and his PhD in 2006 from Georgia Institute of Technology, all in mechanical engineering. At TI, he has worked on thermal and thermo-mechanical analysis for semiconductor packages including modeling and characterization. He also has authored and coauthored more than 20 papers, has written one book chapter, and holds five U.S. patents. He can be reached at sgurrum@ti.com.

Articles
Mechanical Modeling Advances Improve Semiconductor Packaging 1
3D simulations can now address package warpage, interface delamination, and moisture-induced impact to failures.
Commentaries and Blogs
Guest Blogs
Dec 15, 2014
blog

Who Are You? (I Really Want to Know!) 4

Borrowing a stanza from The Who’s hit song seemed like a good way to bring attention to a critical topic often ignored by engineers. When finding information on a company that has an interesting product, what do we do? Of course, we look at its Web page to learn more....More
Dec 15, 2014
blog

Bridging Technical Communication Barriers Between Cultures

Understanding technical concepts in different languages can sometimes prove to be difficult, particularly when you have to communicate it. In this article, I discuss the challenges and possible courses of action....More
Dec 1, 2014
blog

Programming Efficiency 7

When I started college, the Intel 4004 was being designed. The C programming language and UNIX operating system were being developed (unbeknownst to me). I did most of my programming in BASIC on an HP 2100 series mini-computer....More
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