LCR Concept Addresses High Pin Count BGA Apps

The company’s layer count reduction (LCR) concept promises significant cost savings without sacrificing performance by reducing the layer count of standard pitch BGA boards by up to 40%. Board thickness is often a mechanical issue in terms of docking height and/or connector requirements. Other approaches used to slim down boards, such as using thinner cores, are limited due to manufacturability and performance. With the company’s design-to-delivery PCB services, it leverages the capabilities of its board fabrication site and the expertise of its design team. MULTITEST ELEKTRONISCHE SYSTEME GmbH, Rosenheim, Germany. +49-(0)8031-406 0.