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  1. What's The Difference Between IPv4 and IPv6
  2. What’s the Difference Between 3G and 4G Cellular Systems?
  3. Behind the Scenes at CES 2012
  4. Understanding Modern Digital Modulation Techniques
  5. Does Wi-Fi Put Danger In Your Pocket?
  6. What’s All This Spicey Stuff, Anyhow? (Part I)
  7. Tools Enable More Analog Innovation In 2012
  8. Automotive ICs Keep Catastrophes At Bay
  9. High-Power LED Modules Demand Specialized Electrical Test Tools and Techniques
  10. Formal Techniques for Protocol Verification: A Case Study On Verifying the ARM ACE Protocol

  • When Heat Is On, Thermal Characterization Keeps Things Cool

    By David Maliniak, February 07, 2012

    Accurate thermal management depends on accurate simulation models. Mentor Graphics' thermal characterization and analysis methodology builds thermal models of IC packages and LEDs for use in FloTHERM thermal simulations.

  • Co-Design Reliability Relies On Sound Validation Approaches

    By Darvin Edwards, January 06, 2012

    Nowhere does "garbage in, garbage out" apply more than to models and simulation. TI's Darvin Edwards discusses how to ensure that you're validating IC-package co-design models properly against physical measurements.

  • PCB Design Suite Takes On System-Level, Multi-Board Challenges

    By , December 05, 2011

    Zuken's CR-8000 PCB design suite is now complete with the addition of the Design Force tool, which adds system-level, multi-PCB design capabilities to the mix.

  • Data Management For EDA Apps Sees Gains In 2011

    By David Maliniak, November 29, 2011

    Sometimes a tool's management of the data it generates is as important as the data itself. This year's Best in EDA winners, Mentor Graphics' Calibre RealTime and Altium's Altium Designer 10, both make their mark through innovative data-management schemes.

  • Common Ground: Seeking Pin Assignment Balance in FPGA-Based Boards

    By Bruce Riggins, November 21, 2011

    Integrating these ever-more complicated devices into their host PCBs has proven to be extraordinarily challenging. With better FPGA design-in tools that communicate in several languages, FPGA design-in can be a faster, less frustrating endeavor.

  • Cultivate A Model Of Success In Co-Design

    By Darvin Edwards, November 10, 2011

    Don't let physical stresses or thermal mismatches derail your chip/package/board co-design efforts! TI's Darvin Edwards shows you how to work through some common co-design pitfalls.

  • Consortium Drives Open PCB Design-Data Standard

    By David Maliniak, October 05, 2011

    The IPC-2581 Consortium seeks to promote the IPC-2581 design-data transfer format as a standard for the PCB design and fabrication communities. But is it the right standard for the industry?

  • Use Thermal Analysis And Other Types Of Simulation To Craft A “Cool” Design

    By Byron Blackmore, September 16, 2011

    Thermal analysis is critical in determining potential failure mechanisms in ICs, packages, and boards. What is often less well understood is how thermal analysis ties in with electrical and electromagnetic analyses. This article digs into those dependencies.

  • Thermal Analysis and Other Simulation Types

    By Byron Blackmore, July 27, 2011

    Thermal analysis is critical in determining potential failure mechanisms in ICs, packages, and boards. What is often less well understood is how thermal analysis ties in with electrical and electromagnetic analyses. This article digs into those dependencies.

  • Take Chip Package Co-Design Modeling From Concept To System Qualification

    By Darvin Edwards, July 26, 2011

    In the first installment of his column, Demystifying Package Design, TI's Darvin Edwards outlines the complex interactions that make the synergies between an IC and its packaging so difficult to tease out.

  • Treat ICs, Packages, And PCBs As System Designs

    By David Maliniak, March 16, 2011

    The interdependencies between an IC, its package, and the PCB board carrying them demand that all three be designed concurrently. This article looks at the design issues and potential solutions.

  • Board-Level Design Suite Takes On Engineering-Data Management

    By David Maliniak, March 16, 2011

    Altium Designer 10 seeks to serve as not just a system-level design environment, but also to manage and track all of the disparate design data that goes into a project, including supply-chain information.

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