By Staff, February 25, 2010
Free Rubber Polymer And Material Selection Guide
By Françoise Von Trapp, January 07, 2010
Contributing editor Françoise Von Trap writes about 3D technology and packaging in Electronic Design's 2010 Forecast issue and highlights some of the research going on with TSV (through-silicon via) technology.
By Staff, December 02, 2009
FDFMA2P859T MicroFET thin package
By Staff, November 12, 2009
CV-2391 debuts as a low outgassing, room-temperature vulcanizing foam that does not require additional processing to achieve NASA E 595 standards for Total Mass Loss
By Giles Humpston, October 22, 2009
Through-silicon vias (TSV) are conceptually very simple to produce, but issues of reliability remain. However, by focusing on special-case conditions, it’s possible to realize TSV solutions that meet all the requirements for commercial success.
By William Wong, October 08, 2009
Developers can’ t get enough processing power, memory, and I/O ports. Of course, having them on-chip is just the start. Getting them connected to do useful work is another matter. Modular techniques have led to a range of form factors
By Paul Whytock, October 01, 2009
Tin whiskers -- those tiny filaments that grow from the surface of tin -- can be a reliability nightmare. ED Europe's Paul Whytock covers a few of the ways in which the industry has endeavored to surmount the problems.
By William Wong, July 23, 2009
XMOS recently released its single-core version of its quad-core XS-G4, the XS1-L1. The XS1-L1 core is the same XS-G4. It handles eight hardware-based threads that can be activated by the 64 peripheral I/O pins that have a 10-ns timing resolution. This all
By Mike Delaus, July 23, 2009
Wafer-level chip-scale packages (WLCSPs) now enable medical treatments that were previously impossible to implement. Article describes manufacturing and test of the ICs.
By Richard Crisp, July 23, 2009
Multi-Die Packaging Update.
By ED News Staff, June 10, 2009
In a bold move to enrich its printed-circuit-board (PCB) portfolio, Advanced Circuits Inc. acquired the assets of Circuit Board Express. The Haverhill, Mass.-based Circuit Board Express is recognized as a leader in quick-to-market manufacturing of PCBs.
By ED News Staff, June 03, 2009
Researchers at Arizona State University's Flexible Display Center (FDC) and the University of Texas at Dallas (UT Dallas) have successfully produced CMOS circuitry on a flexible plastic substrate.