By Roger Allan, March 03, 2011
As IC dimensions get smaller and smaller, the need for increasing packaging densities becomes greater. And the logical way to do this is via 3D packaging. A key approach is to use through-silicon vias (TSVs). But this technology is not quite ready, although it is making some key advances. Needed are valid business models guidelines on how different manufacturing, design, and packaging houses should interact with each other in this effort.