By Staff, February 01, 2010
the µPD9281GC super-resolution application-specific standard product (ASSP) supports the low-voltage differential signaling (LVDS) interface, thereby reducing the number of necessary external components
By Staff, January 13, 2010
MAX4951AE dual-channel buffer redrives SATA I and SATA II signals and integrates a cable-detect function
By Staff, January 08, 2010
The LSM303DLH digital compass module integrates a three-axis digital accelerometer with a three-axis digital magnetic sensor.
By Staff, December 21, 2009
By Staff, November 17, 2009
Chip Sets Up Electronics/Bio-Cell Communications
By Staff, October 05, 2009
By ED News Staff, February 09, 2009
Under real-world testing of a type of computing that thrives on random errors, Rice University scientists have unveiled a microchip that uses 30 times less power while running seven times faster than the best existing technologies.
By Richard Quinnell, January 15, 2009
The steady progress of ASIC design in embracing each new semiconductor process node has stalled at 45 nm. Meanwhile, earlier process generations remain viable as mask costs fall.
By ED News Staff, January 08, 2009
2Wire has selected the BCM7405 digital set-top box system-on-a-chip (SoC) to power 2Wire’s new Mediapoint digital media player, according to Broadcom Corp. The MediaPoint player enables service providers to quickly provide their customers with entertainme
By Staff, October 08, 2008
Poised for deployment in multimedia and office automation designs, the 32-bit SH7764 microprocessor specifies a maximum operating frequency of 324 MHz and delivers 583-MIPS performance. The device operates over a temperature range from -40°C to
By Staff, October 08, 2008
Enlisting a TMS320C6455 DSP from Texas Instruments, the latest version of the MityDSP customizable CPU platform delivers five to six times greater processing performance than the company's original platform. Thanks to the DSP, it collects, processes,
By Staff, October 08, 2008
Akros Silicon's AS1854 PoE power SoC with 2-kV isolation, which eliminates optocouplers and integrates the functionality of up to nine ICs, targets next-generation IP applications.