By Matt Williams, March 11, 2010
By Pearl Lee, March 02, 2010
Learn how using formal verification can take you beyond the limitations of directed-random simulation when debugging silicon. A series of case studies provide real-world usage examples of Jasper Design Automation's tools.
By Ashwini Govindaraman, February 11, 2010
The latest iteration of the Universal Serial Bus improves speed by a factor of 10 over its predecessor and offers a number of advantages over other interface technologies.
By Jit Lim, February 10, 2010
A solid understanding of the basics can help with accurate jitter characterization. Here’s what you need to know to get on track.
By Jerry Ramie, January 07, 2010
There will be many opportunities for designing new products for the smart grid. Jerry Ramie of ARC Technical Resources analyzes the layers of interaction that must be supported.
By Rick Fisette, November 24, 2009
Automatic test-pattern generation (ATPG) tools have evolved to be able to automatically analyze fault data. Learn how automated debug analysis can help you close the gap in scan coverage on your next SoC design.
By John S. Hansen, November 12, 2009
The ability to achieve level accuracy that provides meaningful measurement results depends on external leveling techniques that correct for mismatches and frequency-response variations.
By John S. Hansen, November 12, 2009
The addition of a high-output RF signal generator not only simplifies your RF test setup, it also can overcome some of the issues associated with lossy cables and components.
By Steven Bible, November 06, 2009
When trying to design circuits with extremely low power consumption, author Steven Bible suggest you consider capacitor selection, circuit desing and microcontroller power saving features.
By Sweta Bhatt, November 04, 2009
Authors Bhatt and Patel explain Internet Wide Area RDMA Protocol, or iWARP, a joint project by Carnegie Mellon University and Intel Corp. and describe iWarp components and applications.
By Giles Humpston, October 22, 2009
Through-silicon vias (TSV) are conceptually very simple to produce, but issues of reliability remain. However, by focusing on special-case conditions, it’s possible to realize TSV solutions that meet all the requirements for commercial success.