A line of flex circuits based on liquid-crystal polymer (LCP) dielectric film provides several enhanced properties required for demanding flexible-circuit applications. The circuits offer dimensional stability, chemical resistance, and high-frequency dielectric properties superior to those of polyimide, the most commonly used flex-circuit substrate.
The LCP flex circuits feature a low water absorption rate of 0.1% versus polyimide's 1% to 3%. As a thermoplastic polymer, an LCP film's high-temperature tolerance makes it compatible with soldering and wire-bonding operations. The LCP process creates fine-line features in a roll-to-roll format without adhesives or physical punching. The LCP flex circuit meets the needs of sophisticated electronic assemblies increasingly in demand for optoelectronic, medical, liquid-crystal module displays, microelectromechanical systems, disk drives, and high-frequency applications.
The company is providing customized prototypes of LCP flex circuits to selected electronics customers. Custom orders are accepted. Pricing greatly depends on volume and design.
3M Microinterconnect Systems Division
(888) 3M-HELPS; www.3m.com/microflex