High-Density SMT Connectors Sport 0.05” Pitch

The company’s high-density, 0.05” pitch through-hole and surface-mount spring-loaded connectors are available in single- and double-row strip packaging. Each is gold plated and assembled in a high temperature thermoplastic insulator suitable for wave and reflow soldering processes. The Series 854-22-0XX-10-001101 and 855-22-0XX-10-001101 through-hole insulators feature molded standoffs and tail diameters of 0.016” that require minimal diameter plated holes for connector mounting, maximizing signal routing between pins. Series 854-22-0XX-30-001101 and 855-22-0XX-30-001101 surface mount spring connectors stand less than 0.23” tall when engaged mid-stroke (0.0275”).  Each SMT spring pin features a base geometry of 0.00” round by 0.01” tall to maximize soldering surface area and promote solder joint fillet. MILL-MAX MANUFACTURING CORP., Oyster Bay, NY. (516) 922-6000.