Groomed for use in feature-rich 2.5G and 3G mobile phones, the company's latest line of multichip package (MCP) memory combines its NAND flash memory with Mobile DRAM featuring Endur-IC technology in a single package. According to the company, the memory meets the market’s increasing demand for high density, small form factor, and low-power devices. The high-density NAND and Mobile DRAM MCP devices are currently sampling to select customers and are expected to be available in 1-Gb NAND and 512-Mb Mobile DDR DRAM configurations in the fourth quarter. For further information, call MICRON TECHNOLOGY INC., Boise, ID. (208) 368-3900.
Company: MICRON TECHNOLOGY INC.
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