STMicroelectronics’ rugged PowerFLAT 5x6 HV and 5x6 VHV packages feature the large insulation path lengths and clearances required for operation up to 650 or 800 V, within the same 5- by 6-mm footprint of a standard 100-V PowerFLAT 5x6. This results in a 52% smaller footprint than the DPAK. The 1-mm-high PowerFLAT packages also incorporate a large exposed metal drain pad to maximize heat dissipation into printed-circuit-board thermal vias. The company will offer three 650-V MDmesh V MOSFETs (STL12N65M5) in the 5x6 HV (high voltage) package, and four 800-V SuperMESH 5 MOSFETs (STL2N80K5) in the 5x6 VHV (very high voltage) package. It’s also sampling two new 600-V fast-switching MDmesh II Plus low Qg MOSFETs in the 5x6 HV.

STMICROELECTRONICS