SiC Planar MOSFET Paper Takes Top PCIM 2012 Prize

By Paul Whytock, May 15, 2012

Selected from a total of 230 contributions, it focuses on next-generation silicon-carbide (SiC) planar MOSFETs, trench structure Schottky diodes, and trench MOSFETs.

AMS To Represent Electrovipryamitel’s Power Semis In Europe

By Paul Whytock, May 15, 2012

A pan Eurpoean partnership between AMS Technologies, provider of power and thermal-management products, and Electrovipryamitel, developer and manufacturer of IGBTs, SFRD modules, and diode-thyristors, will provide local design support for next-generation power electronics applications.

Cascode Configured GaN Switch Enables Faster Switching Frequencies And Lower Losses

By Paul Schimel, May 14, 2012

IR's Paul Schimel explains International Rectifier's half-bridge modules that employ IR's Gallium Nitride MOSFETs

Heterogeneous Cores Turn Off Transistors To Save Power

By Linley Gwennap , May 10, 2012

The combination of architectural techniques such as heterogeneous multicore and new advances in transistor design should enable a continual increase in processor performance and capabilities for at least the next decade.

Optimised IPM Spawns Energy-Efficient Motors

By Alberto Guerra, May 09, 2012

Traditional interior permanent magnet (IPM) solutions for the 30W to 200W inverterised motor-drive market require either a large construction or use of an external heatsink. International Rectifier's alternative approach uses PCB copper traces to dissipate heat from the module. As a result, it has a smaller package design and can eliminate an external heatsink.

IGBTs, FETs Play It Cool At PCIM

By Paul Whytock, May 09, 2012

IGBT and FET innovations stole the thunder at PCIM 2012. Switching and on-resistance efficiencies lay at the heart of many such breakthroughs.

Design Custom Chips That Maximize Battery Life

By Navraj Nandra, May 09, 2012

Synopsys' Navraj Nandra uses a hypothetical tablet computer to explain ways to save power in a new design through better custom-chip design: in the USB driver (and USB alternatives), colapsible power supplies,and new sleep states.

Power To The Process: Semiconductor Technologies Tackle Tough Power Challenges

By Dr. Georges Tchouangue, May 08, 2012

Dr. Georges Tchouangue, Chief Engineer at Toshiba Electronics Europe (TEE), discusses how new fabrication processes and techniques are helping power semiconductors address stringent performance, efficiency, space and noise criteria.

PCIM Europe 2012 Breaks Exhibitor Record

By Paul Whytock, May 08, 2012

PCIM 2012 Europe occupied two halls. In addition to exhibiting companies the show offered panel discussions, VIP interviews, a round table, and over 50 vendor presentations

Fairchild Puts On A Power Display At PCIM

By Staff, May 08, 2012

Fairchild Semiconductor demonstrated a range of power solutions at PCIM, featuring silicon and solutions for industrial power, automotive, LED lighting, and dc-dc conversion.

Rugged GaN-on-SiC Transistors Operate At 50V

By Staff, May 08, 2012

Richardson RFPD has new gallium-nitride (GaN) on silicon-carbide (SiC) family of power transistors from M/A-COM Technology Solutions.

Compact MOSFETs Take To Sleek Mobile Apps

By Staff, May 08, 2012

Renesas Electronics added eight low-loss P- and N-channel power MOSFETs, optimised for use in portable electronics such as smartphones and tablets, to its range of devices.

Logic ICs Operate With Slowly Changing Input Signals

By Staff, May 08, 2012

Toshiba expanded its TC74VHC family of very-high-speed logic with a range of ICs that combine Schmitt trigger inputs with voltage-tolerant output capabilities.

Gateway, EPCOS, And TDK Ink UK Distribution Deal

By , May 08, 2012

Gateway Electronic Components has secured an agreement with TDK to distribute EPCOS and TDK products in the UK

System Remotely Configures Gate-Drive Resistors

By Staff, May 08, 2012