Electronic Design - RoHS Home

The RoHS Reference Center, from Electronic Design, is designed to provide electronic design engineers with lead free information they need to specify or purchase lead free electronic components in compliance with the Restrictions on Hazardous Substances directive - commonly known as the lead-free directive. The substances covered by the RoHS Directive are scientifically well researched and evaluated and have been subject to different measures both at community and at national level. Member States shall ensure that, from 1 July 2006, new electrical and electronic equipment put on the market does not contain lead ("lead free"), mercury, cadmium, hexavalent chromium, polybrominated biphenyls (PBB) or polybrominated diphenyl ethers (PBDE).

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Initial Thermal Path Failures and Necessary Controls

Sponsor: Texas Instruments

Improvements in IC mold compounds and Die Attach materials have enabled improved Moisture Sensitivity Level (MSL) classifications at higher temperatures. As an example, a 48 pin HPQFP that had been MSL classified at 5a (24 hour floor life) for 235 Degree C reflow has now successfully passed MSL3 (168 hours floor life) for 260 Degree reflow...

PowerPAD MSL Performance Improvement

Sponsor: Texas Instruments

Materials and Controls have been identified to improve the MSL performance of PowerPAD packages from ~ MSL5a @ 235 C to ~ MSL3 @ 260 C for TI's S_PQFP-G packages (48 pin PHP& 64 pin PAP). This performance level now meets the customer's requirement, and is achieved using Lead(Pb)-Free, NiPdAu leadframes. This MSL rating includes thermal path testing...

"Green" QFN Packages from Texas Instruments

Sponsor: Texas Instruments

Texas Instruments (TI) has recently taken proactive steps to introduce its package options as "Green," including its Quad Flat No-lead (QFN) packages. The QFN packages are near-chip-scale plastic encapsulated packages that use conventional copper lead frame technology, without peripherally protruding leads, within their construction...

Material Composition of RoHS and JIG Compliant Plastic Surface-Mount Integrated Circuits

Sponsor: Texas Instruments

Semiconductors manufacturers are working to meet lead-free, RoHS, and JIG material restrictions. In many cases, this requires changes in the materials utilized in the fabrication and assembly of integrated circuits. Several approaches to solve this material change problem have been considered throughout the industry…

Selecting the Right RoHS Compliant Finish

Sponsor: Texas Instruments

As the RoHS deadline approaches there is continued discussion about Lead(Pb)-Free finish selection for leadframe based packages. The majority of integrated circuit (IC) manufacturers will use tin (Sn) as their replacement for tin-lead (SnPb) in post-mold plating operations. A few component...

Meeting RoHS Compliance for Power Package Options

Sponsor: Texas Instruments

There has been industry wide movement for the last several years to eliminate environmentally harmful materials from semiconductor packaging. The European Union’s Restriction of Hazardous Substances (RoHS) directive requires that electronic components restrict the amounts of materials found to be harmful to the environment...

TI Means RoHS Business on Standard Linear and Logic Devices!

Sponsor: Texas Instruments

July 1, 2006 is rapidly approaching. This is the date the European Union’s Restriction of Hazardous Substances (RoHS) Directive takes affects. As most in the industry know, this legislation bans the use of Lead, Mercury, Cadmium, Hexavalent Chromium, Polybrominated Biphenyls, and Polybrominated Diphenyl Ethers. The result is that electronic component manufacturers must now supply semiconductor components...

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