DesignCon 2008
DesignCon 2008 attracted engineering professionals from various levels and disciplines representing many aspects of electronic design: applications engineering, architecture and systems design, ASIC design, circuit-board design, embedded-systems design, hardware/software integration, high-performance systems, IC design, packaging, semiconductor product management, service and support, SoC design, software development, testing and debugging, and more.
Electronic Design’s Digital Editor Dan Harris was there, click below for some of his video interviews.
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| Video from DesignCon 2008 |
 Dr. Eric Bogatin, President of Bogatin Enterprises dicusses testing high-speed differential signals. |
 John Andresakis,VP of Strategic Technology at Oak-Mitsui discusses buried capacitance in PCBs. |
 John Mitchell, Sr. Director, Marketing & Applications Engineering from Quellan, Inc. discusses analog ICs for extending cable reach and backplane signal integrity.
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 Faride Akretch, Marketing Manager from Tektronix, Inc. discusses TekExpress one-touch Serial ATA compliance testing.
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 Brock LaMeres, Ph.D., an Electrical Designer for Probing Technology, Inc. discusses PCI Express (Gen 1) probing solutions.
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