By Henry Santana, May 04, 2012
Electronic loads are electronically controllable resistances used to test power circuit behavior at load resistances close to zero. This short piece shows how to build one using two op amps, an FET, a pot, a fixed resistor and an auxiliary (battery) supply.
By Brad Albing, May 04, 2012
How to use Intersil's ISL6132 for overvoltage sensing.
By Alexander Asinovski, April 04, 2012
This design idea extends the ability of a battery-monitoring data acquisition IC to allow temperature monitoring of up to 12 batteries in a power saving design with minimal error.
By Don Tuite, August 30, 2010
By Louis E. Frenzel, November 05, 2007
The testing of any new wireless receiver design usually requires conventional test instruments such as a vector signal generator and appropriate output instruments like a scope, vector signal analyzer, or spectrum analyzer. But t
By Daniel Harris, October 25, 2007
As field-programmable gate arrays (FPGAs) continue to drop in price while adding significant capability, their use has expanded greatly in industrial control and monitoring applications. And since FPGAs are in-system/field-programmable
By Daniel Gallant, May 24, 2012
Getting the best performance from the PCI Express interface requires careful selection of the clocking method.
By Daniel Herzog, May 24, 2012
First found decades ago in chicken brooders, these components still are effective in applications ranging from soda machines to submarines.
By Ian Bower, May 23, 2012
TI's Ian Bower looks at the differences between implenting analog and mixed-signal functionality hardware and firmware with the goalof helping designers in one domain comfortable when working with designers in the other.
By Jack Browne, July 26, 2011
Newer power RF semiconductor technologies are enabling higher power levels in smaller device sizes, making packaging materials a real concern. Beryllium oxide (BeO), aluminum nitride (AlN), and alumina (Al2O3) are good thermal conductors, and BeO has long been the ceramic of choice for microelectronics packages through about 4 GHz.
By Jefferay Lawton, March 04, 2011
Here are a number of alternative ways to avoid problems when driving Varactor Diodes.
By Staff, November 30, 2010
By David Maliniak, May 25, 2012
Building a modular test strategy can provide great flexibility in capabilities, or the system can be tailor-made for specific requirements. Often a hybrid approach encompassing traditional box instruments is best. Here are some basics to consider in formulating an approach that will work best for you.
By Jay Mckenna, May 23, 2012
Micro fasteners enable lower part counts and assembly time resulting in smaller, lighter, thinner, and cheaper consumer electronics.
By Andy Gryc, May 21, 2012
HTML5 is poised to take over the Internet. Here are the basics about this technology.
Power / Paul Whytock
The first 3G network was launched nearly a decade ago. Subsequent 3G deployments were criticised for being too expensive and lacking a single global standard. While the initial Long-Term Evolution
Stereoscopic 3D effects were introduced in films during the 1950s. It was a short-lived fad, not least because of the geeky glasses. 3D TVs, electronic games, and even mobile phone displays that
During the bi-annual DSEi show in London, nearly 1300 suppliers of military hardware and software showed off their latest gizmos, inlcuding some seriously clever heat masking technology which can
Simplify design complexity and increase your energy efficiency in limited PCB space with Fairchild’s low-, mid-, and high power LED Lighting solutions. The right topology, components and support for your design success.
Get expertise in the power for processors and FPGAs arena -- visit the Power for Processors microsite from Texas Instruments and Electronic Design. Check out:
By Paul Whytock, May 22, 2012
If you’re heading to the show, be sure to make the most of the semiconductors, sausages, and sauerkraut.
By Staff, May 22, 2012
Students from the Technical University of Iasi, Romania, won the final round of the EMEA Freescale Cup Challenge, a competition where student teams build, program, and race an intelligent model car.
By Paul Whytock, May 15, 2012
Selected from a total of 230 contributions, it focuses on next-generation silicon-carbide (SiC) planar MOSFETs, trench structure Schottky diodes, and trench MOSFETs.
A pan Eurpoean partnership between AMS Technologies, provider of power and thermal-management products, and Electrovipryamitel, developer and manufacturer of IGBTs, SFRD modules, and diode-thyristors, will provide local design support for next-generation power electronics applications.
By Alberto Guerra, May 09, 2012
Traditional interior permanent magnet (IPM) solutions for the 30W to 200W inverterised motor-drive market require either a large construction or use of an external heatsink. International Rectifier's alternative approach uses PCB copper traces to dissipate heat from the module. As a result, it has a smaller package design and can eliminate an external heatsink.
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Designers forge new motion control path for hybrids and EVs...
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