News http://electronicdesign.com/taxonomy/term/25777/more en 5th Generation Intel Core Processors Enhance Graphic Capabilities http://electronicdesign.com/embedded/5th-generation-intel-core-processors-enhance-graphic-capabilities <div class="node-body article-body">congatec Inc. has revamped its COM Express module and Thin Mini-ITX motherboard to accommodate Intel’s 5th generation Core processors. </div> <div class="og_rss_groups"></div><p><a href="http://electronicdesign.com/embedded/5th-generation-intel-core-processors-enhance-graphic-capabilities" target="_blank">read more</a></p> http://electronicdesign.com/embedded/5th-generation-intel-core-processors-enhance-graphic-capabilities#comments Products Boards Embedded modules Thu, 15 Jan 2015 20:25:00 +0000 833101 at http://electronicdesign.com Planar Transformers Ideal for Power Conversion Applications http://electronicdesign.com/power/planar-transformers-ideal-power-conversion-applications <div class="node-body article-body">The latest planar transformers from Standex-Meder Electronics are ideal for 500W-2KW applications.</div> <div class="og_rss_groups"></div><p><a href="http://electronicdesign.com/power/planar-transformers-ideal-power-conversion-applications" target="_blank">read more</a></p> http://electronicdesign.com/power/planar-transformers-ideal-power-conversion-applications#comments Products Power Thu, 15 Jan 2015 19:53:00 +0000 833091 at http://electronicdesign.com Copper Bonding Technology Reduces Pitch for 3D Chipsets http://electronicdesign.com/digital-ics/copper-bonding-technology-reduces-pitch-3d-chipsets <div class="node-body article-body">A consortium successfully demonstrated the use of copper-copper (Cu-Cu) diffusion bonding technology, which could lead to reduced production costs for 3D chipset manufacturers.</div> <div class="og_rss_groups"></div><p><a href="http://electronicdesign.com/digital-ics/copper-bonding-technology-reduces-pitch-3d-chipsets" target="_blank">read more</a></p> http://electronicdesign.com/digital-ics/copper-bonding-technology-reduces-pitch-3d-chipsets#comments Trends & Analysis Digital ICs Embedded Tue, 13 Jan 2015 19:52:00 +0000 832981 at http://electronicdesign.com <p>The copper-copper (Cu-Cu) bonding technology will influence manufacturers who make ICs, like the ones seen above, pictured on a silicon wafer. (Image courtesy of the ESA)</p> ESA Pursues 3D-Rendering Software Solution to Study Comets http://electronicdesign.com/virtual-instruments/esa-pursues-3d-rendering-software-solution-study-comets <div class="node-body article-body">The European Space Agency (ESA) is partnering with the Qt Company to develop a 3D-rendering software module that will play a key role in characterizing comets.</div> <div class="field-content-focus"> <span>Content Classification:&nbsp;</span> Curated </div> <div class="og_rss_groups"></div><p><a href="http://electronicdesign.com/virtual-instruments/esa-pursues-3d-rendering-software-solution-study-comets" target="_blank">read more</a></p> http://electronicdesign.com/virtual-instruments/esa-pursues-3d-rendering-software-solution-study-comets#comments Hot Topics Embedded virtual instruments Thu, 08 Jan 2015 13:57:00 +0000 832811 at http://electronicdesign.com Geppetto 2.0 Board Introduces Tux-Approved Mappings http://electronicdesign.com/boards/geppetto-20-board-introduces-tux-approved-mappings <div class="node-body article-body">Gumstix has announced the release of Geppetto 2.0, the company’s build-to-order tool.</div> <div class="og_rss_groups"></div><p><a href="http://electronicdesign.com/boards/geppetto-20-board-introduces-tux-approved-mappings" target="_blank">read more</a></p> http://electronicdesign.com/boards/geppetto-20-board-introduces-tux-approved-mappings#comments Products Boards Embedded Tue, 06 Jan 2015 19:28:00 +0000 832691 at http://electronicdesign.com Wearable Tech at CES Unveiled 2015 http://electronicdesign.com/embedded/wearable-tech-ces-unveiled-2015 <div class="node-body gallery-body">Wearable tech continues to reign supreme at CES, with everything from roller skates to swing analysis tools that will help up your tennis game.</div> <div class="og_rss_groups"></div><p><a href="http://electronicdesign.com/embedded/wearable-tech-ces-unveiled-2015" target="_blank">read more</a></p> http://electronicdesign.com/embedded/wearable-tech-ces-unveiled-2015#comments Hot Topics Android Trends & Analysis Communications Embedded iOS WiFi Mon, 05 Jan 2015 21:22:00 +0000 832591 at http://electronicdesign.com VITA Perspective 2015 http://electronicdesign.com/boards/vita-perspective-2015 <div class="node-body article-body">VITA Executive Director, Jerry Gipper, peers into his crystal ball to highlight VITA trends for for 2015 including VPX and VME technology. </div> <div class="og_rss_groups"></div><p><a href="http://electronicdesign.com/boards/vita-perspective-2015" target="_blank">read more</a></p> http://electronicdesign.com/boards/vita-perspective-2015#comments Trends & Analysis Boards Thu, 18 Dec 2014 19:01:00 +0000 832071 at http://electronicdesign.com System Simulation Requires Cooperation http://electronicdesign.com/systems/system-simulation-requires-cooperation <div class="field-deck"> Simulation allows evaluation of a system without having an actual system available. This is becoming more important as system complexity grows and time-to-market shrinks. </div> <div class="node-body article-body">Simulation has become a requirement for ASIC development. The cost of creating an actual chip is high as is the turnaround time to make corrections. A chip needs to work the first time. Chip simulation allows designs to be tested...</div> <div class="og_rss_groups"></div><p><a href="http://electronicdesign.com/systems/system-simulation-requires-cooperation" target="_blank">read more</a></p> http://electronicdesign.com/systems/system-simulation-requires-cooperation#comments Trends & Analysis Systems Thu, 18 Dec 2014 16:54:00 +0000 832051 at http://electronicdesign.com eXtremeDB IMDS Shows Compatibility With GNAT Pro Tools http://electronicdesign.com/dev-tools/extremedb-imds-shows-compatibility-gnat-pro-tools <div class="node-body article-body">McObject has announced that its eXtremeDB In-Memory Database System (IMDS) has been tested and proven compatible with AdaCore’s GNAT Pro Ada development environment. </div> <div class="og_rss_groups"></div><p><a href="http://electronicdesign.com/dev-tools/extremedb-imds-shows-compatibility-gnat-pro-tools" target="_blank">read more</a></p> http://electronicdesign.com/dev-tools/extremedb-imds-shows-compatibility-gnat-pro-tools#comments Products Dev Tools Embedded Mon, 15 Dec 2014 16:00:00 +0000 831831 at http://electronicdesign.com Dual-Screen VR Chip Boosts Bandwidth by 80% http://electronicdesign.com/displays/dual-screen-vr-chip-boosts-bandwidth-80 <div class="node-body article-body">The VR7200 chip developed by Spectra7 Microsystems features high-speed, active signal processing and a super-thin cable to provide a more immersive virtual-reality (VR) experience. </div> <div class="og_rss_groups"></div><p><a href="http://electronicdesign.com/displays/dual-screen-vr-chip-boosts-bandwidth-80" target="_blank">read more</a></p> http://electronicdesign.com/displays/dual-screen-vr-chip-boosts-bandwidth-80#comments Hot Topics Displays Embedded Fri, 12 Dec 2014 17:55:00 +0000 831711 at http://electronicdesign.com <p>The VR7200 chip developed by Spectra7 Microsystems features high-speed, active signal processing and a super-thin cable to provide a more immersive virtual-reality (VR) experience. (Image courtesy of Thinkstock)</p>