Trends & Analysis http://electronicdesign.com/taxonomy/term/25780/more en MEMS Mirrors Show Promise in Perceptual Computing http://electronicdesign.com/digital-ics/mems-mirrors-show-promise-perceptual-computing <div class="node-body article-body">MEMS mirrors are being used to advance perceptual computing technology, which promotes human-computer interaction through the use of electrostatic principles. </div> <div class="og_rss_groups"></div><p><a href="http://electronicdesign.com/digital-ics/mems-mirrors-show-promise-perceptual-computing" target="_blank">read more</a></p> http://electronicdesign.com/digital-ics/mems-mirrors-show-promise-perceptual-computing#comments Trends & Analysis Digital ICs ST Microelectronics Intel Wed, 04 Mar 2015 21:23:00 +0000 835791 at http://electronicdesign.com Autonomous Firefighting Robot Finds Its Balance http://electronicdesign.com/systems/autonomous-firefighting-robot-finds-its-balance <div class="node-body article-body">SAFFiR is a bipedal humanoid robot being developed to assist U.S. Navy sailors with damage control and inspection operations aboard naval vessels. </div> <div class="og_rss_groups"></div><p><a href="http://electronicdesign.com/systems/autonomous-firefighting-robot-finds-its-balance" target="_blank">read more</a></p> http://electronicdesign.com/systems/autonomous-firefighting-robot-finds-its-balance#comments Defense Trends & Analysis Systems Thu, 12 Feb 2015 16:08:00 +0000 835151 at http://electronicdesign.com <p>SAFFiR is a bipedal humanoid robot being developed to assist U.S. Navy sailors with damage control and inspection operations aboard naval vessels. (Photo courtesy of U.S. Navy/John F. Williams.)</p> Glass-Welded Hermetic Seals Secure CMOS Sensors from Thermal Shifts http://electronicdesign.com/digital-ics/glass-welded-hermetic-seals-secure-cmos-sensors-thermal-shifts <div class="node-body article-body">Primoceler and ON Semiconductor combined efforts to manufacture CMOS sensor packages that use glass welding to enhance durability.</div> <div class="og_rss_groups"></div><p><a href="http://electronicdesign.com/digital-ics/glass-welded-hermetic-seals-secure-cmos-sensors-thermal-shifts" target="_blank">read more</a></p> http://electronicdesign.com/digital-ics/glass-welded-hermetic-seals-secure-cmos-sensors-thermal-shifts#comments Trends & Analysis Digital ICs Thu, 12 Feb 2015 15:24:00 +0000 835141 at http://electronicdesign.com <p>Optical sensors are used in a variety of applications, ranging from military to consumer. (Image courtesy of Primoceler)</p> From Complicated to a Cakewalk: Partnership Focuses on 3D-ICs http://electronicdesign.com/digital-ics/complicated-cakewalk-partnership-focuses-3d-ics <div class="node-body article-body">Fujitsu will leverage ANSYS’ RedHawk and Sentinel power noise and reliability solutions to help simplify the design of three-dimensional integrated circuits (3D-ICs).</div> <div class="og_rss_groups"></div><p><a href="http://electronicdesign.com/digital-ics/complicated-cakewalk-partnership-focuses-3d-ics" target="_blank">read more</a></p> http://electronicdesign.com/digital-ics/complicated-cakewalk-partnership-focuses-3d-ics#comments Trends & Analysis Digital ICs Embedded Thu, 12 Feb 2015 15:12:00 +0000 835131 at http://electronicdesign.com <p>A graphical representation of a stack of individual chips connected by through-silicon vias (TSVs). (Image courtesy of IBM)</p> Project Paves a Path Toward Optical-System Miniaturization http://electronicdesign.com/electromechanical/project-paves-path-toward-optical-system-miniaturization <div class="node-body article-body">The Lab4MEMS II project will focus on developing micro-opto-electromechanical systems (MOEMS) for use in miniaturized optical devices.</div> <div class="og_rss_groups"></div><p><a href="http://electronicdesign.com/electromechanical/project-paves-path-toward-optical-system-miniaturization" target="_blank">read more</a></p> http://electronicdesign.com/electromechanical/project-paves-path-toward-optical-system-miniaturization#comments Trends & Analysis Electromechanical Fri, 06 Feb 2015 16:01:00 +0000 834501 at http://electronicdesign.com <p>ST Microelectronics currently offers a variety of MEMS products spanning different applications. (Image courtesy of ST Microelectronics)</p> With Silicene, Science Turns Theory into Actual Material http://electronicdesign.com/digital-ics/silicene-science-turns-theory-actual-material <div class="node-body article-body">Researchers have created a one-atom-thick layer of silicon that one day may be used to construct faster and more power-efficient transistors. </div> <div class="og_rss_groups"></div><p><a href="http://electronicdesign.com/digital-ics/silicene-science-turns-theory-actual-material" target="_blank">read more</a></p> http://electronicdesign.com/digital-ics/silicene-science-turns-theory-actual-material#comments Trends & Analysis Digital ICs Thu, 05 Feb 2015 19:33:00 +0000 834461 at http://electronicdesign.com <p>Silicene is a one-atom-thick layer of silicon organized in a buckled honeycomb lattice.</p> IoT-Device Certification Program Embraces DECT http://electronicdesign.com/communications/iot-device-certification-program-embraces-dect <div class="node-body article-body">The Ultra Low Energy (ULE) Certification Program provides standards for DECT-based devices targeting the Internet of Things (IoT).</div> <div class="og_rss_groups"></div><p><a href="http://electronicdesign.com/communications/iot-device-certification-program-embraces-dect" target="_blank">read more</a></p> http://electronicdesign.com/communications/iot-device-certification-program-embraces-dect#comments Trends & Analysis Communications Wed, 04 Feb 2015 20:19:00 +0000 834401 at http://electronicdesign.com Copper Bonding Technology Reduces Pitch for 3D Chipsets http://electronicdesign.com/digital-ics/copper-bonding-technology-reduces-pitch-3d-chipsets <div class="node-body article-body">A consortium successfully demonstrated the use of copper-copper (Cu-Cu) diffusion bonding technology, which could lead to reduced production costs for 3D chipset manufacturers.</div> <div class="og_rss_groups"></div><p><a href="http://electronicdesign.com/digital-ics/copper-bonding-technology-reduces-pitch-3d-chipsets" target="_blank">read more</a></p> http://electronicdesign.com/digital-ics/copper-bonding-technology-reduces-pitch-3d-chipsets#comments Trends & Analysis Digital ICs Embedded Tue, 13 Jan 2015 19:52:00 +0000 832981 at http://electronicdesign.com <p>The copper-copper (Cu-Cu) bonding technology will influence manufacturers who make ICs, like the ones seen above, pictured on a silicon wafer. (Image courtesy of the ESA)</p> Wearable Tech at CES Unveiled 2015 http://electronicdesign.com/embedded/wearable-tech-ces-unveiled-2015 <div class="node-body gallery-body">Wearable tech continues to reign supreme at CES, with everything from roller skates to swing analysis tools that will help up your tennis game.</div> <div class="og_rss_groups"></div><p><a href="http://electronicdesign.com/embedded/wearable-tech-ces-unveiled-2015" target="_blank">read more</a></p> http://electronicdesign.com/embedded/wearable-tech-ces-unveiled-2015#comments Hot Topics Android Trends & Analysis Communications Embedded iOS WiFi Mon, 05 Jan 2015 21:22:00 +0000 832591 at http://electronicdesign.com VITA Perspective 2015 http://electronicdesign.com/boards/vita-perspective-2015 <div class="node-body article-body">VITA Executive Director, Jerry Gipper, peers into his crystal ball to highlight VITA trends for for 2015 including VPX and VME technology. </div> <div class="og_rss_groups"></div><p><a href="http://electronicdesign.com/boards/vita-perspective-2015" target="_blank">read more</a></p> http://electronicdesign.com/boards/vita-perspective-2015#comments Trends & Analysis Boards Thu, 18 Dec 2014 19:01:00 +0000 832071 at http://electronicdesign.com